Preliminary Helio X30 benchmark reveals AnTuTu score of 160000 points

Analyst Pan Jiutang discussed on his Weibo page about some putative data on some upcoming flagship SoCs that will eventually supplant the current high-end offerings.

MediaTek Helio X30

This successor to the Helio X20 will be produced at TSMC on a 10 nm FinFET process. The X30 will offer a similar tri-cluster solution for a total of 10 cores: 2x 2.8 GHz Artemis cores, 4x Cortex-A53 cores, and 4x Cortex-A35 cores. The integrated GPU will be the PowerVR 7XT. Raw performance will allow for cameras of up to 26 MP and support for VR, up to 8 GB RAM, and integrated Cat. 13 LTE connectivity. The powerful Artemis cores are considered successors to the Cortex-A72 cores as found on the Helio X20. Screenshots show that the new SoC will break all records with a supposed AnTuTu benchmark of 160,000+ points.

Qualcomm Snapdragon 830

The successor to the current Snapdragon 820 is expected to come to market by next year and be manufactured in a similar 10 nm FinFET process as the above MediaTek SoC. The Snapdragon 830 should be making use of eight Kryo cores for improved performance without the overheating issues that plagued the Snapdragon 810 series. The upcoming Snapdragon 823 refresh supposedly coming later this year should make the wait for the Snapdragon 830 a little easier.

Kirin 960

Detailed information about Huawei's next flagship SoC is still scarce. So far, it is assumed that the successor will be named Kirin 960 and be produced in a similar 16 nm process as the current generation of Kirin SoCs. If true, power consumption will likely be behind the next generation Qualcomm and MediaTek flagships. The chip will likely have an octa-core setup with integrated Cat. 12 LTE support and come in Huawei's next Mate 9 by the end of this year. Unfortunately, Jiutang has no concrete information on the successor to Samsung's current Exynos 8890 SoC as found on the Galaxy S7 series.

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