Helio X20 SoC troubled by overheating
MediaTek’s upcoming Helio X20 SoC was officially announced back in May last year. Being the first deca-core mobile chipset on the market, it had instantly sparked a lot of interest among industry media. It is also expected to be a worthy alternative for Qualcomm’s Snapdragon 820 and Samsung’s Exynos 8890 chips. Unfortunately, according to a new report, the X20 is experiencing overheating problems which puts the scheduled March launch in question.
This is not the first issue that the Taiwanese chipmaker faced when preparing the new chip for launch. Initially, the Helio X20 had problems with proper Wi-Fi module operation but luckily those were quickly resolved. The overheating issue, however, is reportedly more serious and is raising doubts that the company might not manage to fix it before the end of March, when X20 is supposed to be launched.
The MediaTek Helio X20 contains 10 computing cores divided into three groups. First one consists of two 2.5 GHz ARM-Cortex A72 cores for maximum performance. Second one is made of four medium-performance 2 GHz ARM-Cortex A53 cores. The third group, containing four of the same A53 cores but clocked at 1.4 GHz, will be used for least power-hungry tasks.
According to the manufacturer, the new SoC design will allow to increase power efficiency by as much as 30 percent when compared to standard use of ARM’s „big.LITTLE” architecture without any performance degradation.
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