Optomec announces a new 3D Printing Interconnect solution that boosts 5G signals by up to 100%
Optomec has revealed its new semi-conductor packaging solution, which seemingly boosts transmitted signal power by up to 100%. The company developed this solution to meet the strong market demand for the mm-wave electronics market. Common growth areas in the electronics market include 5G, medicine, defense and self-driving vehicles.
Even though the implementation of mm-wave integrated circuits (ICs) has a compound annual growth rate of 27%, its adoption in applications faced challenges due to previous methods that resulted in poor circuit performance, low wireless ranges and high-power consumption. However, Optomec argued that its 3D Printed Interconnect solution resolves this deficient circuit performance with low loss connections.
According to Optomec, its clients recorded an exponential boost in signal performance. This is apparently due to its ICs functioning at lower power levels and temperatures, which produces higher ranges for wireless data transmission. With Optomec’s technology, future wireless mm-wave networks can perform at frequencies up to 53 GHz, which is multiple times faster than the common 5 GHz band.
Optomec employed the use of Aerosol Jet printing and claimed that it is more efficient than previous methods of connecting ICs such as utilising gold wires. The company designed a new Aerosol Jet HD2 printer that has a very high printing resolution and functions by jetting very small droplets of nanoparticle conducting inks onto circuit boards and other materials. Aerosol Jet printing is utilised by more than 200 companies globally such as Samsung, GE and the US Army.
Source(s)
