MediaTek Helio P70 sticking to 12 nm FinFET, ready to launch next month
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The MediaTek Helio P60 made its debut back in February at MWC 2018. Fast-forward eight months and the company is now announcing a direct successor with the reveal of the premium Helio P70.
According to the press release, the octa-core P70 will boast enhanced AI processing that should make it more competitive with this year's Apple A12 Bionic and Huawei Kirin 980 in the iPhone XS Max and Mate 20 Pro, respectively. Called NeuroPilot, the improved AI enhancements promise 10 to 30 percent faster processor performance over the P60 with support for real-time face recognition not unlike on current popular flagships.
The SoC follows the same big.LITTLE configuration of the P60 with 2.1 GHz 4x Cortex-A73 cores and 2.0 GHz 4x Cortex-A53 cores and an integrated Mali-G72 MP3 GPU running at up to 900 MHz. MediaTek says users can expect a GPU gain of 13 percent over the P60 with 20 percent faster RAW HDR video processing and 18 percent reduced power consumption.
Note that the SoC will still be produced in a 12 nm FinFET fabrication process whereas Apple, Samsung, and Qualcomm have already moved on to the more efficient 7 nm node. MediaTek SoCs have always been about cost efficiency and introducing high-end features to more affordable mid-range smartphones, so the more reliable 12 nm process is unsurprising.
Smartphones sporting the new Helio P70 are set to be unveiled in just a couple of weeks. If earlier rumors are any indication, then Xiaomi could be one of the first OEMs out of the gate with a Helio P70 device.
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