Apple M4 (10 cores) vs Intel Core Ultra 5 245HX vs Intel Core Ultra 7 255HX

Apple M4 (10 cores)

The 10-core Apple M4 is an impressively fast ARM architecture processor (SoC) sporting 4 performance and 6 efficient CPU cores along with a 16-core neural engine and a 10-core GPU with hardware RT support and other modern features. On-package 7500 MT/s LPDDR5x RAM, USB 4 support and Thunderbolt 4 support are onboard as well, as are Wi-Fi 6E and Bluetooth 5.3.

The M4 debuted in May 2024 as part of an iPad launch event; its 4 performance cores run at up to 4.4 GHz, representing a healthy improvement over the M3 (10-core GPU) and its 4.06 GHz top clock speed. Besides, this new chip also has 6 efficient cores at its disposal that run at up to 2.9 GHz. The M3 had to make do with 4 performance cores and 4 efficient cores, for reference.

Architecture and Features

The new CPU cores run at faster clock speeds than what the M3 was capable of while also featuring some minor architectural improvements. A heavily customized version of ARM's v9.4-A microarchitecture is reportedly employed here. The M4 comes with on-package LPDDR5x-7500 RAM (120 GB/s) whereas the M3 was limited to 6400 MT/s. The updated NPU delivers up to 38 TOPS of performance for AI workloads.

Performance

In 2024 iPad Pros, the 3 nm chip is 10% to 20% faster than the M3 (10 GPU cores) in both multi-thread and single-thread short-term workloads. It also delivers about 10% higher multi-thread performance than the 9-core M4. This puts the 10-core part on an equal footing with the Ryzen 7 7745HX, Core i7-13705H and other higher-end x86 processors released in 2023 and 2024.

iPad Pros come with no active cooling solution however Mac minis and MacBook Pros do have one and the latest iMacs probably do as well. As our Fall 2024 Mac mini review shows, the M4's short-term performance doesn't benefit much from the presence of a fan, however its sustained performance benefits tremendously.

Graphics

The M4 GPU (10 cores) has hardware support for ray tracing as well as mesh shading and other modern technologies. It supports external displays with resolutions as high as 8K.

The graphics adapter runs at higher clock speeds than what the (otherwise identical) 10-core GPU built into the 9-core M4 can muster. As our Mac mini 2024 review confirmed, its performance is good enough to run many 2023 and 2024 games at 1080p on low or medium quality settings.

• Сyberpunk 2077 2.1 Phantom Liberty (1080p, Med): 28 fps

Much like it is with CPU performance, M4-powered iPad Pros will be much slower in long-term GPU-intensive workloads than iMacs, Mac minis and MacBook Pros due to the lack of proper cooling.

Power consumption

This specific M4 chip is found in 2024 iPad Pros, 2024 iMacs, 2024 Mac minis and 2024 MacBook Pros. Within the thin metal cases of the iPads - no active cooling - the chip's sustained power consumption hovers in the 4 W - 5 W area, with short-term peaks of up to 14 W possible. However, Mac minis and MacBook Pros do have an active cooling solution (and the new iMacs probably do, too) meaning the power consumption figures are several times higher. In our Fall 2024 Mac mini review, the SoC consumed 30 W to 40 W when under high loads.

The M4 is built with a "second generation" 3 nm TSMC process which is still cutting-edge as of late 2024.

Intel Core Ultra 5 245HX

The Intel Core Ultra 5 245HX is a fast mid-range mobile CPU for gaming notebooks based on the Arrow Lake architecture. It offers 20 cores consisting of 6 of the 8 fast performance cores with up to 5.1 GHz and 8 of the 16 smaller efficiency cores with up to 4.5 GHz clock speed. The CPU can access 24 MB L2 cache and 26 MB L3 cache and is specified with a TDP of 55 watts.

The SoC integrates a small dedicated NPU called AI Boost with 13 TOPS (Int8) and optionally supports vPro Enterprise. The integrated memory controller supports up to 192 GB DDR5-6400 (dual channel, ECC optional). The integrated GPU (iGPU) is a small graphics card called Intel Graphics, which offers three of the four Xe cores with 300 - 1900 MHz.

Performance - High End

Thanks to the improved IPC of the cores (especially the efficiency cores), the CPU should be just before or at the level of the Raptor Lake Core i9-14500HX (6 + 8 cores, max 5 / 3.5 GHz). This makes the CPU very suitable for demanding tasks such as high-end gaming (2024 games) and content creation.

Production - TSMC and Foveros

The Arrow Lake-HX chips are based on the desktop Arrow Lake-S chips and are composed of several chiplets. The CPU part is manufactured at TSMC in the modern N3B (3nm) process, the GPU also comes from TSMC in the N5P process. The SoC and I/O tile are manufactured in the TSMC N6 process. The base tile is manufactured by Intel in the 22nm process and carries the individual chiplets thanks to Fovero's 3D packaging.

Intel Core Ultra 7 255HX

The Intel Core Ultra 7 255HX is a mobile high-end CPU for gaming notebooks based on the Arrow Lake architecture. It offers 20 cores consisting of 8 fast performance cores with up to 5.2 GHz and 12 of the 16 smaller efficiency cores with up to 4.5 GHz clock speed. The CPU has access to 30 MB L2 cache and 36 MB L3 cache and is specified with a TDP of 55 watts.

The SoC integrates a small dedicated NPU called AI Boost with 13 TOPS (Int8) and optionally supports vPro Essentials. The integrated memory controller supports up to 192 GB DDR5-6400 (dual channel, ECC optional). The integrated GPU (iGPU) is a small Intel Graphics graphics card with four Xe cores running at 300 - 1850 MHz.

Performance - High End

Thanks to the improved IPC of the cores (especially the efficiency cores), the CPU should perform just behind or at the level of the Raptor Lake Core i9-14700HX (8 + 12 cores, max 5.5 / 3.9 GHz). This makes the CPU ideal for demanding tasks such as high-end gaming and content creation.

Production - TSMC and Foveros

The Arrow Lake-HX chips are based on the desktop Arrow Lake-S chips and are composed of several chiplets. The CPU part is manufactured at TSMC in the modern N3B (3nm) process, the GPU also comes from TSMC in the N5P process. The SoC and I/O tile are manufactured in the TSMC N6 process. The base tile is manufactured by Intel in the 22nm process and carries the individual chiplets thanks to Fovero's 3D packaging.