Intel could challenge TSMC’s dominance as Apple and Qualcomm eye EMIB and Foveros packaging for next-gen chips
Intel has been attracting attention with its new semiconductor packaging technologies. The company could finally have found a response to TSMC’s dominance in that area as Apple and Qualcomm post new job listings for engineers familiar with Intel’s EMIB and Foveros technologies.
Intel’s EMIB and Foveros: an alternative to TSMC’s CoWoS
One advantage of Intel’s Embedded Multi-Die Interconnect Bridge (EMIB) is that it does not require a large, expensive interposer, as in TSMC’s CoWoS. EMIB achieves this by using a small integrated silicon bridge to enable communication between multiple chiplets in a single package.
The result could appeal to companies like Apple and Qualcomm, which want to reduce manufacturing complexity while retaining high interconnect bandwidth.
Foveros Direct 3D packaging builds on EMIB by using through-silicon vias (TSVs) to vertically stack dies. This ensures more direct interconnect paths, enhances power efficiency, and reduces latency.
EMIB and Foveros technologies can be applied in AI, data centers, and mobile devices.
Apple and Qualcomm test the waters
Apple has now revealed it is looking to sign on engineers with experience in “advanced packaging technologies such as CoWoS, EMIB, SoIC, and PoP” through a recent job advert.
Qualcomm is seeking similar expertise in the form of a Director of Product Management for its data center business unit.
The vacancies suggest Intel’s packaging technologies are being explored by major semiconductor players. This is significant, as TSMC continues to face supply constraints due to its bulk clients, such as Nvidia and AMD.
A rare opening in a crowded market
Industry watchers speculate Intel’s foundry services (IFS) can gain a foothold if the US-based company can take advantage of TSMC’s stretched capacity. There are encouraging signs, as even Nvidia CEO Jensen Huang described Foveros as one of the most advanced 3D integration solutions in the industry.
While placing job adverts is hardly conclusive evidence that Intel’s packaging technologies will gain traction, what it signals is that some players may be considering them as a viable alternative to TSMC’s solution.
