MWC 2016 | Hisense unveils A1, C1, C20, L676 and L697 mainstream smartphones
Hisense is largely known as a manufacturer of household appliances in China, but is certainly not a stranger in consumer electronics or the smartphone market. The manufacturer has unveiled a new lineup of affordable smartphones including the A1 with its dual rear cameras and fingerprint sensor, the rugged C20 and its robust IP67 chassis, the C1 and its AMOLED panel and 5.7 mm thickness, the L697 and its 2.5D glass touchscreen and Quick Charge 2.0, and the L676 with its dual SIM features and OGS (One Glass Solution) touchscreen. OGS uses a thinner touch panel on top of the display, so onscreen content tend to pop and appear closer to the surface.
Whether or not these smartphones will launch in Europe is not currently known. Fortunately, a few core specifications for each have been revealed as follows with a more complete sheet to come in the near future:
A1:
- 5.5-inch FHD AMOLED panel
- Unspecified octa-core processor (likely MediaTek)
- 3 GB RAM
- 32 GB eMMC w/ MicroSD support
- Dual 13 MP rear + 5 MP front w/ dual LED Flash cameras
- 3000 mAh battery
The dual rear cameras of the A1 promise better pictures even in poorly lit conditions.
C20:
- 5-inch IPS panel
- Unspecified octa-core processor (likely MediaTek)
- 16 GB eMMC
- IP67 certified (shock, dirt, and water resistant)
- 13 MP rear + 5 MP front cameras
- 8.6 mm thickness
- 3000 mAh battery
C1:
- 5.5-inch AMOLED panel
- Unspecified octa-core processor (likely MediaTek)
- 16 GB eMMC
- 13 MP rear + 5 MP front cameras
- 5.73 mm thickness
- 2500 mAh battery
- Dual SIM slots
L697:
- 5.5-inch 2.5D glass touchscreen (rounded edges and corners)
- Unspecified octa-core processor (likely MediaTek)
- 3 GB RAM
- Quick Charge 2.0 support
- 16 MP rear w/ dual Flash + 8 MP front w/ Flash cameras
L676:
- 5-inch 720p OGS touchscreen
- Unspecified octa-core processor (likely MediaTek)
- 2 GB RAM
- 13 MP rear + 5 MP front cameras
- 2320 mAh battery
- Dual SIM slots
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