Galaxy S26 series: Exynos 2600 tipped to get a better cooling solution
Samsung is expected to power some or all of its Galaxy S26 series phones with the Exynos 2600 SoC. The Exynos chips have proven to be more difficult to cool but it looks like the company has come up with a solution and it comes in the form of a ‘heat pass block’ (HPB). If it does result in a cooler SoC, Samsung would be more willing to fit all of its future flagship phones with its in-house processor.
According to a report by ET News (machine translated), Samsung is planning on adding an HPB to the Exynos 2600 chip that functions as a heatsink and more effectively dissipates heat. This would theoretically result in the SoC being able to reach higher clock speeds and maintain them for longer, depending on how much heat the HPB can dissipate. As per the image shared by the publication, the current design has the DRAM sitting on top of the Exynos chip. With the new design, the HPB will sit beside the DRAM on top of the chip, leading to better heat dissipation.
The report adds that the company is evaluating the performance of this new setup and if the yields are positive, it could lead to a more widespread use of the Exynos processor. Up till now, performance and heat dissipation have been the shortcomings of Samsung’s chip which has kept it from competing with the top tier Snapdragon and Dimensity chips.
As for the Galaxy S26 series, if the report is accurate, adding an extra component to the production process could lead to higher costs. This could lead to relatively higher pricing for the Galaxy S26 series. However, even though the Exynos 2600 has been popping up in benchmarks and leaks, it is unclear at this point if Samsung will actually stick with the SoC for its next gen Galaxy S series phones.
Source(s)
