Intel Xeon E-2186M vs Apple M3 Pro 11-Core

Intel Xeon E-2186M

The Intel Xeon E-2186M is a high-end processor for professional laptops with six cores based on the Coffee Lake architecture. The processor clocks at between 2.9 - 4.8 GHz (4.3 GHz with 6 cores) and can execute up to twelve threads simultaneously thanks to Hyper-Threading. The 4.8 GHz can only be reached using the "Thermal Velocity Boost" which allows one core to boost to 4.8 GHz (+200 MHz) as long as the CPU temperature is below 50°C. Multiple cores can be boosted +100 MHz below 50°C.

According to Intel, the CPU is manufactured in an improved 14nm (14nm++) process. Together with the Core i9-8950HK, the E-2186M is the fastest mobile processor in early 2018. Compared to the similar consumer Core i9, the mobile Xeon offers support for ECC main memory but has a locked multiplicator (no overclocking).

The Coffee Lake architecture is similar to Kaby Lake and differs only in the amount of cores (now six cores for the high end versions) and the improved 14nm process (14nm++ according to Intel).

Performance

Due to the two additional cores, performance has increased by almost 50% compared to a similar clocked Kaby Lake processor.

Graphics

The integrated Intel UHD Graphics 630 iGPU is supposed to offer a slightly higher performance as its clock rate has been increased by 50 MHz. The architecture is identical to that of the Intel HD Graphics 630. We do expect a performance improvement, but as a low-end solution it will probably only display current games smoothly at reduced details - if at all.

Power Consumption

Intel specifies the TDP with 45 watts and therefore the i9 is only suited for big laptops with good cooling solutions.

Apple M3 Pro 11-Core

The Apple M3 Pro 11 Core is a system on a chip (SoC) from Apple for notebooks that was introduced late 2023. It integrates 11 of the 12 CPU cores with 5 of 6 performance cores with up to 4.06 GHz and 6 efficiency cores with 2.8 GHz.

Compared to the M2 Pro the M3 Pro has been slimmed down somewhat and swaps two performance cores for efficiency cores. This is due to the changed core configuration, as 6 cores are now used per cluster (the M2 Pro and M3 still have 4 cores per cluster). Furthermore, the memory bus has been reduced from 256 bits to 192 bits (150 GB/s vs. 200 GB/s). Thanks to the new architecture and higher clock rates, the new M3 Pro is still slightly faster.

The M3 Pro also integrates a new graphics card with dynamic caching, mesh shading and ray tracing acceleration via hardware. In the entry-level model, only 14 of the chip's 18 cores are used and support up to 3 displays simultaneously (internal and 2 external).

GPU and CPU can jointly access the shared memory on the package (unified memory). This is available in 18 or 36 GB variants and offers 150 GB/s maximum bandwidth (192 bit bus).

The integrated 16-core Neural Engine has also been revised and now offers 18 TOPS peak performance (compared to 15.8 TOPS in the M2 but 35 TOPS in the new A17 Pro). The video engine now also supports AV1 decoding in hardware. H.264, HEVC and ProRes (RAW) can still be decoded and encoded.

Unfortunately, the integrated WLAN only continues to support WiFi 6E (no WiFi 7), unlike the small M3 SoC thunderbolt 4 is also supported (max 40 Gbit/s).

The chip is manufactured in the current 3nm process (N3B) at TSMC and contains 37 billion transistors (-7.5% vs. Apple M2 Pro).