MediaTek Dimensity 900 vs HiSilicon Kirin 980

MediaTek Dimensity 900

The Mediatek Dimensity 900 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A78 cores at up to 2.4 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 4 core ARM Mali-G68 MC4 GPU, a Wi-fi 6 modem, a LPDDR4x memory controller, a AI processing unit  and video de- and encoding.

The Dimensity 900 is manufactured in the modern 6nm process and should be very power efficient.

HiSilicon Kirin 980

The HiSilicon Kirin 980 is an ARM based high-end octa-core SoC for smartphones and tablets, which was introduced with the Huawei Mate 20 Pro in late 2018. It integrates eight CPU cores in three clusters. The performance cluster contains two Cortex-A76 cores with up to 2.6 GHz, the balanced cluster contains also two Cortex-A76 cores but with only up to 1.92 GHz and finally the power saving cluster contains four small ARM Cortex-A53 cores with up to 1.8 GHz. Furthermore, the SoC integrates a modern LTE radio with Cat 21/18 (max. 1400 Mbps download, 200 Mbps upload), 2x faster dual ISP (versus 970), a LPDDR4X 2133 MHz memory controller (34.1 GB/s versus 29.9 GB/s of the Kirin 970) and a 2160p30 H.265 video encoder (2160p60 decoding). The Kirin 980 is produced in the modern 7nm process at TSMC as the first Android SoC (after the Apple A12).