MediaTek Dimensity 8100 vs Qualcomm Snapdragon 870 5G vs MediaTek Dimensity 1300

MediaTek Dimensity 8100

The Mediatek Dimensity 8100 is a upper mid-range smartphone SoC. The CPU integrates four fast ARM Cortex-A78 cores with up to 2.85 GHz and four efficient Cortex-A55 cores with up to 2 GHz. The integrated 5G modem supports all modern standards including 5G SA and a maximum download speed of 4.7 Gbps.

The integrated ARM Mali-G610 MC6 GPU integrates 6 cores and supports displays with up to 2,960 x 1,440 pixels (WQHD+).

The chip is produced at TSMC in 5nm.

Qualcomm Snapdragon 870 5G

The Qualcomm Snapdragon 870 5G Mobile Platform (SM8250-AC) is a high-end smartphone and tablet SoC that Qualcomm announced in mid 2021. The SoC integrates a fast ‘Prime Core’ that clocks up to 3.2 GHz and three additional ARM Cortex-A77 performance cores, which can reach up to 2.42 GHz. These are complemented by four power-saving ARM Cortex-A55 cores that clock up to a maximum of 1.8 GHz. Compared to the similar and older Snapdragon 865+, the Prime Core clocks 100 MHz faster and the GPU is slightly higher clocked.

Therefore, the Snapdragon 870 is slightly faster than the old Snapdragon 865 and 865 Plus and slots in behind the high end Snapdragon 888.

The Mobile Platform integrates a Qualcomm X55 5G modem with Sub-5 and mmWave support and global 5G bands with up to 7.5 GBit/s (download) speed. The SmartConnect 6800 modem supports Wi-Fi 6 with 8x8 MU-MIMU and 60 GHz 11ay up to 10 Gbps. 

The integrated GPU is still called Adreno 650 and offers a slightly higher clock speed of 670 MHz.

The on board Hexagon 698 DSP now offers a KI performance of up to 15 TOPS (up from 7 TOPS in the 855) and still uses a combination of CPU, GPU, HVX and Tensor cores. The Spectra 480 ISP is also untouched. The integrated Computer Vision Engine (CV-ISP) now supports Dolby Vision, 8K videos and 200 megapixel photos.

The built-in memory controller supports LPDDR5 with up to 2,750 MHz and LPDDR4X with 2,133 MHz.

The SoC is manufactured in the modern and power efficient 7nm process.

MediaTek Dimensity 1300

The Mediatek Dimensity 1300 is a high-end SoC with an integrated 5G modem. It includes three CPU clusters. One fast ARM Cortex-A78 at up to 3 GHz with 2x L2 cache, 3 additional A78 with up to 2.6 GHz and for power efficiency four ARM Cortex-A55 cores at up to 2 GHz. The SoC looks to be identical to the older Dimensity 1200.

Furthermore, the chip integrates a 9 core ARM Mali-G77 MC9 GPU, a Wi-fi 6 modem (ax), a LPDDR4x memory controller (up to 5266Mbps), a AI processing unit (APU 3.0 with 6 cores) and video de- and encoding (including AV1).

The chip is manufactured in the modern 6nm process and should be very power efficient.