Qualcomm Snapdragon 625 vs Mediatek Helio G37

Qualcomm Snapdragon 625

The Qualcomm Snapdragon 625 (SD625) is a mid-range octa-core SoC with eight ARM Cortex-A53 cpu cores at up to 2 GHz, an Adreno 506 GPU, a DDR3L-1866 memory controller and a X9 LTE (Cat 7, 4G+, 300 Mbps down, 150 Mbps up) modem. Furthermore, the chip supports 802.11ac WiFi and Bluetooth 4.1. It is manufactured in 14nm FinFet. The processor performance should be similar to a HiSilicon Kirin 650, which also offers 8 Cortex A53 cores at up to 2 GHz. However, due to the modern manufacturing process, power consumption and throttling should be better with the Snapdragon 625.

Mediatek Helio G37

The Mediatek Helio G37 is an entry level ARM SoC for smartphones (mainly Android based) that was introduced in late 2020. It is manufactured in a 12 nm FinFET process and is equipped with 8 ARM Cortex-A53 CPU cores clocked at up to 2.3 GHz. They are divided in two clusters, with the four efficiency cores only clock up to 1.8 GHz. Compared to the similar Helio G35, the G37 offers support for 90 Hz displays and 8 GB RAM.

The performance of the G37 is positioned in the entry level and especially the single core performance is very slow due to the small A53 cores and no big performance cores.

Furthermore, the SoC integrates a LTE Cat.4 modem, a Wi-Fi 5 / Bluetooth 5.0 modem, a LPDDR3-933 / LPDDR4-1200 / LPDDR4x-1600 memory controller, a IMG PowerVR GE8320 graphics card, and a 1080p30 video de- and encoder (H.265 decoding, H.264 encoding).

The G37 is produced in 12nm FinFET.