iPhone Ultra foldable's motherboard allegedly leaks weeks before expected launch

A new video and image circulating on X allegedly show board hardware from Apple's rumored foldable iPhone. According to a post from X user @LusiRoy7, the leak includes a short video of the physical board along with a separate AI-cleaned composite image showing both sides of the same board.

The chip visible in the image is claimed to be the A20 Pro, Apple's presumed next-generation flagship chipset. In the image, the SoC die and DRAM are placed side by side, connected via a redistribution layer rather than stacked with an interposer. A redistribution layer is a thin routing structure built directly on the package that reroutes electrical connections between chips without the extra silicon interposer that stacked designs typically require, allowing components to sit flatter next to each other. This approach is expected to improve thermal dissipation and could help keep the module thin enough for a folding chassis. The chip in the video appears to have its top cover removed, since the A20 Pro in other leaked images shows metal-colored packaging on top of the chips.

If genuine, this would be one of the first physical images claiming to show the new hardware in Apple's foldable rather than a render. That said, because the image is an AI-cleaned composite, any fine chip markings should be treated with caution, as cleanup passes can misrender text in areas that were blurry or obstructed in the source footage. Notably, no Apple markings, model numbers, or etchings on shielding cans are visible in either the video or the image, and there is no independent corroboration from other leakers at this time.

As with all early-stage leaks, this should be treated as unconfirmed pending further sourcing. The upcoming Apple foldable, also known by its rumored name, the iPhone Ultra, is expected to launch this September, though general availability could be delayed, with a hefty price tag north of $2,000.