Google Tensor G2 vs MediaTek Dimensity 7300 vs MediaTek Dimensity 1300

Google Tensor G2

The Google Tensor G2 SoC is a chip that was developed by Google and Samsung for the Google Pixel smarthpones. It is the successor to the Google Tensor G1 and still integrates the same CPU cores. This processor part includes two fast ARM Cortex-X1 cores at up to 2.85 GHz (up from 2.8 GHz of the G1), two mid-range Cortex-A78 cores at up to 2.35 GHz and four small ARM Cortex-A55 efficiency cores with up to 1.8 GHz. The caches are identical with 4 MB CPU L3 cache and 8 MB system level cache. Therefore, the CPU performance is very similar to the first generation of the Tensor SoC.

A big upgrade is the new TPU, which should be more powerful and power efficient compared to its predecessor. In our tests, the AI performance is about 50% higher.

The iGPU was also improved, and now uses a more modern ARM Mali G710 architecture with 7 cores.

The chip also integrates a Titan M2 security processor, a LPDDR5 memory controller, and an ISP for 10-bit HDR / 4k/60 video and 108 MP cameras.

The SoC is manufactured in 5nm at Samsung.

MediaTek Dimensity 7300

The MediaTek Dimensity 7300 is an ARM-based mid-range SoC for (mostly Android based) smartphones. The integrated CPU is divided into two clusters with four larger ARM Cortex-A78 cores with up to 2.5 GHz clock speed and an efficiency cluster with four ARM Cortex-A55 cores with up to 2 GHz.

In addition to the integrated ARM Mali-G615 MC2 iGPU, the 7300 also offers a MediaTek APU 655 for AI tasks. Furthermore, a 5G multi-mode modem is installed (2G - 5G) with up to 3.27 Gbps download speed. In addition to Wi-Fi 6E, Bluetooth 5.4 is also supported.

The chip is manufactured using the modern 4nm process and is advertised to consume 25% less power compared to the older Dimensity 7050.

MediaTek Dimensity 1300

The Mediatek Dimensity 1300 is a high-end SoC with an integrated 5G modem. It includes three CPU clusters. One fast ARM Cortex-A78 at up to 3 GHz with 2x L2 cache, 3 additional A78 with up to 2.6 GHz and for power efficiency four ARM Cortex-A55 cores at up to 2 GHz. The SoC looks to be identical to the older Dimensity 1200.

Furthermore, the chip integrates a 9 core ARM Mali-G77 MC9 GPU, a Wi-fi 6 modem (ax), a LPDDR4x memory controller (up to 5266Mbps), a AI processing unit (APU 3.0 with 6 cores) and video de- and encoding (including AV1).

The chip is manufactured in the modern 6nm process and should be very power efficient.