Samsung, SK Hynix and Micron have all breached the 8,500 Mbps barrier for their LPDDR5 memory. Because JEDEC is yet to reveal the specs for LPDDR6 memory, next-gen SoCs could launch with Samsung's newest LPDDR5X modules. It has a throughput of 10,700 Mbps, making it one of the fastest modules on the market.
Samsung says it is manufactured on an unspecified 12 nm node and is optimized for on-device AI applications. The added speed also comes with increased density. OEMs can now potentially pack up to 32 GB of memory in a single package.
Samsung's new LPDDR5X module is 25% faster and power-efficient than its predecessor. It will enter mass production later this year, but there's no word about when it will debut. In all likelihood, it could power high-end smartphones from Xiaomi, Oppo, and Vivo which usually launch by year-end.
24 GB of on-device memory is becoming increasingly common on many high-end (and even mid-range) smartphones, and it won't be long before 32 GB becomes the norm. That, combined with a powerful SoC and software support, could finally let people use their smartphones as a full-time desktop/laptop replacement.