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Samsung intros 128 GB UFS 2.0 embedded memory for smartphones

Samsung 128 GB UFS 2.0 embedded memory chips
Samsung 128 GB UFS 2.0 memory
The industry’s first 128 GB ultra-fast UFS 2.0 embedded memory for next-gen high-end smartphones has just entered mass production.

While most flagship smartphones currently on the market feature 32 GB or 64 GB of internal memory, they will soon top at 128 GB. A recent press release by Samsung reveals that mass production of the industry's first 128 GB embedded memory based on the UFS 2.0 standard has begun.

Universal Flash Storage 2.0 is "the most advanced JEDEC-compliant, next-generation flash memory storage specification in the world" and can perform up to 19k IOPS random reads, 2.7 times faster than the eMMC 5.0 memory used by contemporary high-end smartphones.

UFS memory uses the same "Command Queue" technology employed by SSDs, writing data at 14k IOPS - no less than 28 times faster than conventional external memory cards. It also uses 50 percent less power than eMMC 5.0 chips that are expected to remain attractive for the mid-range and value market segments.

Next to the 128 GB capacity, the new UFS 2.0 embedded memory is also available in 64 GB and 32 GB versions. Samsung concludes the press release by promising "to set the pace for memory solutions that combine truly high-performance with high capacity."

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> Notebook / Laptop Reviews and News > News > News Archive > Newsarchive 2015 02 > Samsung intros 128 GB UFS 2.0 embedded memory for smartphones
Codrut Nistor, 2015-02-26 (Update: 2015-02-26)