Samsung begins production of the Exynos 7 Dual 7270 SoC for wearables

Earlier today, Samsung Korea revealed that mass production of the 14-nanometer Exynos 7 Dual 7270 processor has begun. The new chip targets wearable devices and, according to its makers, is "the first in its class to feature full connectivity and LTE modem integration."

Samsung introduced the 14 nm FinFET technology last year and, since then, they have been pushing for its adoption across the entire spectrum of the market. Ben K. Hur, Vice President of System LSI Marketing at Samsung Electronics, believes that "this AP offers great power savings, 4G LTE modem and full connectivity solution integration, as well as innovative packaging technology optimized for wearable devices." 

The Exynos 7 Dual 7270 uses two Cortex-A53 cores and offers a 20 percent improvement in power efficiency over its 28 nm predecessor. Thanks to the integrated Cat.4 LTE 2CA modem, it allows wearables to connect to mobile networks as standalone devices. It also supports tethering and data transfer between devices, as well as FM radio and GNSS.

Since this chip is now ready to hit device manufacturers, the first devices to use it should come out in early 2017.