Samsung Galaxy S7 could sport both a metal chassis and Hi-Fi sound
The Galaxy S7 is expected to be the "superclass" flagship of 2016. The usual trend is for features and hardware on the luxury end to trickle down on mainstream and affordable devices over time. The fingerprint scanner is an excellent example as it is now found on a number of budget Chinese smartphones. Thus, public eyes and ears will be seeking out what exactly Samsung may be planning for its next high-end feature exclusive to the Galaxy S7.
Rumors from China are claiming that the S7 will use high-strength magnesium alloy for an ultralight and thin chassis without sacrificing rigidity. According to the insider, Samsung has already conducted extensive tests on various potential alloys.
Additionally, the Galaxy S7 may be equipped with a high-performance DAC from ESS Technology. According to the speculation, the smartphone may make use of the dedicated SABRE9018AQ2M audio chip, which was announced for mobile devices at CES 2015. The hardware would allow for high-quality 32-bit stereo conversion at 129 dB SNR (-120 THD+N).
Other rumors include a 3D touschreen with Synaptics Clear Force as a response to Apple's current 3D Touch technology. An Isocell main 20 MP camera, USB Type-C port, and Exynos 8890 SoC are also all in the realm of possibility.
The same report claims that Samsung is hard at work on three new Exynos chips: The Exynos 7422, 7880, and 8890. The 7422 will essentially be a higher-clocked 7420 as found on the Galaxy S6 and Note 5, while the 7880 will likely be used for the affordable Galaxy A series. The 8890 is expected to be the flagship SoC for Samsung's next generation of smartphones.