Qualcomm Snapdragon 888 5G vs MediaTek Dimensity 8020
Qualcomm Snapdragon 888 5G
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The Qualcomm Snapdragon 888 5G Mobile Platform is a high-end SoC for smartphones that was introduced in late 2020 and manufactured in 5 nm at Samsung. Integrates one “Prime Core” based on a ARM Cortex-X1 architecture clocked at up to 2.84 GHz. Three more performance cores are based on the A78 but clock up to 2.42 GHz. Furthermore, four energy saving cores are integrated that are based on the ARM Cortex-A55 architecture and clock at up to 1.8 GHz. In addition to the processor cores, the SoC integrates a WiFi 6e modem, a Hexagon 780 DSP (up to 26 TOPS of AI performance) and a Spectra 580 ISP. The integrated memory controller now supports faster LPDDR5 memory with up to 3,200 MHz. 5G is now included in the chip with the Snapdragon X60 modem.
The performance of the processor cores should be around 15% better than the old Snapdragon 865+. The integrated Adreon 660 GPU should make a bigger jump by 35% (most likely compared to the SD 865).
MediaTek Dimensity 8020
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The MediaTek Dimensity 8020 is a ARM-based System-on-a-Chip (SoC) similar to the older Dimensity 1100. It was specifically designed for use in Android smartphones and falls into the mid-range category in terms of performance. It supports all current mobile network standards, including 5G with 2CC-CA (200MHz) and FDD+TDD.
The CPU consists of a total of eight cores divided into two clusters. One cluster has four ARM Cortex-A78 performance cores with speeds of up to 2.6 GHz, while the other cluster has four ARM Cortex-A55 power-efficient cores with speeds of up to 2.0 GHz. LPDDR4 RAM can be used as the memory, and it supports UFS 3.1 as the internal storage.
In terms of connectivity, it offers Dual-5G support, as well as Wi-Fi 6 and Bluetooth 5.2.
The integrated graphics unit, ARM Mali-G77 MC9, can power displays with a resolution of up to 2560 x 1080 and a refresh rate of up to 144 Hz (possibly only for Full HD+).
The chip is manufactured by TSMC using the current 6nm process in the mid-range segment.
Model | Qualcomm Snapdragon 888 5G | MediaTek Dimensity 8020 | ||||||||||||||||
Codename | Cortex-X1 / A78 / A55 (Kryo 680) | Cortex-A78 / A55 | ||||||||||||||||
Series | Qualcomm Snapdragon | |||||||||||||||||
Series: Snapdragon Cortex-X1 / A78 / A55 (Kryo 680) |
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Clock | 1800 - 2840 MHz | 2000 - 2600 MHz | ||||||||||||||||
L3 Cache | 3 MB | |||||||||||||||||
Cores / Threads | 8 / 8 1 x 2.8 GHz ARM Cortex-X1 3 x 2.4 GHz ARM Cortex-A78 4 x 1.8 GHz ARM Cortex-A55 | 8 / 8 4 x 2.6 GHz ARM Cortex-A77 4 x 2.0 GHz ARM Cortex-A55 | ||||||||||||||||
TDP | 5 Watt | |||||||||||||||||
Technology | 5 nm | 6 nm | ||||||||||||||||
Features | Adreno 660 GPU, Spectra 580 ISP, Hexagon 780, X60 5G Modem, FastConnect 6900 WiFi,LPDDR5-6400 / LPDDR4X-4266 MHz Memory Controller (64 Bit) | 4x ARM Cortex-A77 (2.6 GHz), 4x ARM Cortex-A55 (2 GHz), ARM Mali-G77 MP9, APU 570, 5G Modem, MiraVision HDR10+, Wi-Fi 6, Bluetooth 5.2, UFS 3.1, LPDDR4x | ||||||||||||||||
iGPU | Qualcomm Adreno 660 | ARM Mali-G77 MP9 | ||||||||||||||||
Chip AI | 26 TOPS INT8 | |||||||||||||||||
Architecture | ARM | ARM | ||||||||||||||||
Announced | ||||||||||||||||||
Manufacturer | www.qualcomm.com | www.mediatek.com |
Benchmarks
Average Benchmarks Qualcomm Snapdragon 888 5G → 100% n=16
Average Benchmarks MediaTek Dimensity 8020 → 85% n=16

* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation