Qualcomm Snapdragon 870 5G vs Qualcomm Snapdragon 888 Plus 5G

Qualcomm Snapdragon 870 5G

The Qualcomm Snapdragon 870 5G Mobile Platform (SM8250-AC) is a high-end smartphone and tablet SoC that Qualcomm announced in mid 2021. The SoC integrates a fast ‘Prime Core’ that clocks up to 3.2 GHz and three additional ARM Cortex-A77 performance cores, which can reach up to 2.42 GHz. These are complemented by four power-saving ARM Cortex-A55 cores that clock up to a maximum of 1.8 GHz. Compared to the similar and older Snapdragon 865+, the Prime Core clocks 100 MHz faster and the GPU is slightly higher clocked.

Therefore, the Snapdragon 870 is slightly faster than the old Snapdragon 865 and 865 Plus and slots in behind the high end Snapdragon 888.

The Mobile Platform integrates a Qualcomm X55 5G modem with Sub-5 and mmWave support and global 5G bands with up to 7.5 GBit/s (download) speed. The SmartConnect 6800 modem supports Wi-Fi 6 with 8x8 MU-MIMU and 60 GHz 11ay up to 10 Gbps. 

The integrated GPU is still called Adreno 650 and offers a slightly higher clock speed of 670 MHz.

The on board Hexagon 698 DSP now offers a KI performance of up to 15 TOPS (up from 7 TOPS in the 855) and still uses a combination of CPU, GPU, HVX and Tensor cores. The Spectra 480 ISP is also untouched. The integrated Computer Vision Engine (CV-ISP) now supports Dolby Vision, 8K videos and 200 megapixel photos.

The built-in memory controller supports LPDDR5 with up to 2,750 MHz and LPDDR4X with 2,133 MHz.

The SoC is manufactured in the modern and power efficient 7nm process.

Qualcomm Snapdragon 888 Plus 5G

The Qualcomm Snapdragon 888+ (Plus) 5G Mobile Platform is a high-end SoC for smartphones that was introduced in mid 2021 and manufactured in 5 nm at Samsung. 

Integrates one “Prime Core” based on a ARM Cortex-X1 architecture clocked at up to 3 GHz. Three more performance cores are based on the A78 but clock up to 2.42 GHz. Furthermore, four energy saving cores are integrated that are based on the ARM Cortex-A55 architecture and clock at up to 1.8 GHz. In addition to the processor cores, the SoC integrates a WiFi 6e modem, a Hexagon 780 DSP (up to 26 TOPS of AI performance) and a Spectra 580 ISP. The integrated memory controller now supports faster LPDDR5 memory with up to 3,200 MHz. 5G is now included in the chip with the Snapdragon X60 modem.

Compared to the older Snapdragon 888, the 888+ offers a slightly higher clocked prime core (+160 MHz) and a 23% faster Hexagon 790 DSP. Therefore, it is now the fastest Android SoC (at the time of announcement), but still slightly slower (CPU and GPU) than the Apple A14 and A15 Bionic SoCs.