Qualcomm Snapdragon 750G 5G vs MediaTek Dimensity 900 vs MediaTek Dimensity 8050

Qualcomm Snapdragon 750G 5G

The Qualcomm Snapdragon 750G 5G (SM7225 Mobile Platform) is a fast mid-range ARM-based SoC largely found on Android tablets and smartphones. It integrates eight cores (octa-core) divided into two clusters. A fast performance cluster contains two ARM Cortex-A77 cores clocked at up to 2.2 GHz and a power efficiency cluster with six small ARM Cortex-A55 cores at up to 1.8 GHz. Depending on the workload only single clusters or all cores can run at different clock speeds.

The chip includes a range of other features like a fast X52 5G radio (3700 Mbits download including Sub-6 and mmWave), Wi-Fi 6 wireless radio (802.11ax), satellite positioning (GPS, QZSS, GLONASS, SBAS, Beidou, Galileo), USB-C 3.1, Spectra 355L ISP, Hexagon 694 DSP, H.265 4K30 video en- and decode, and a Adreno 619 GPU.

The G specifies an optimized SoC for gaming and e.g. Qualcomm offers updates for the graphics driver.

The Snapdragon 750G is manufactured in the modern 8 nm process at Samsung.

MediaTek Dimensity 900

The Mediatek Dimensity 900 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A78 cores at up to 2.4 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 4 core ARM Mali-G68 MC4 GPU, a Wi-fi 6 modem, a LPDDR4x memory controller, a AI processing unit  and video de- and encoding.

The Dimensity 900 is manufactured in the modern 6nm process and should be very power efficient.

MediaTek Dimensity 8050

The MediaTek Dimensity 8050 is an ARM-based SoC (System-on-a-Chip) manufactured at TSMC using the 6nm process.  It supports all current mobile standards including dual-SIM 5G (5G SA & NSA, max 4.7 Gbps download and 2.5 Gbps upload). The SoC also supports Wi-Fi 6 and Bluetooth 5.2.

The MediaTek Dimensity 8050 was specially designed for use in Android smartphones and is classified in the upper mid-range in terms of performance.

The CPU part consists of three clusters: a fast performance core, based on the ARM Cortex A78 architecture and clocked at up to 3 GHz. The second cluster consists of three Cortex-A78 cores with up to 2.6 GHz. Four ARM Cortex-A55 cores with up to 2 GHz are installed as a power-saving cluster.

The integrated ARM Mali-G77 MC9 graphics unit can drive displays with a resolution of up to 2,560 x 1,080 and a refresh rate of up to 144 Hz (possibly only with Full HD+).

Technically, the SoC is similar to the older Dimensity 1300.