Qualcomm Snapdragon 695 5G vs MediaTek Dimensity 8300-Ultra vs Qualcomm Snapdragon 6s Gen 3
Qualcomm Snapdragon 695 5G
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The Qualcomm Snapdragon 695 5G (SD695) is a fast mid-range ARM-based SoC largely found on Android tablets and smartphones. It features 8 Kryo 660 called cores (64-Bit capable) that are divided in two clusters. A fast cluster of two cores with up to 2.2 GHz based on the ARM Cortex-A78 design. And a power saving efficiency cluster with up to 1.7 GHz based on much smaller ARM Cortex-A55 cores. Both clusters can also used together. The successor of the SD695 is the Snapdragon 6s Gen 3 with slightly higher clocked cores.
In addition to the 8 CPU cores, the SoC integrates a lower mid range Adreno 619 GPU, a X51 5G radio (up to 2.5 Gbits download, no mmWave), a 802.11ac (Wi-Fi 5, 8x8 sounding, Dual Band, 2x2), a Bluetooth 5.2 radio, satellite positioning (GPS, QZSS, GLONASS, SBAS, Beidou and Galileo) and a video engine (support for H.265, H.264, VP8 and VP9).
Compared to the previous SD690, the SD695 is now manufactured in 6nm (instead of 8nm) and offers a higher clocked performance cluster. However, the SD695 only supports Wi-Fi 5 instead of Wi-Fi 6 of the SD690.
MediaTek Dimensity 8300-Ultra
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The MediaTek Dimensity 8300-Ultra presented in Q4 2023 is an ARM-based SoC (system-on-a-chip) that is manufactured using the 4 nm process. It was specially designed for use in Android smartphones and is in the lower upper class in terms of performance. It supports all current mobile communication standards, including 5G SA.
The CPU works with a total of eight cores, which are divided into two clusters. The first cluster contains one ARM Cortex-A715 power core, which operates at up to 3.35 GHz. In addition, there are 3 further ARM Cortex-A715 cores with 3.2 GHz. The second cluster contains four ARM Cortex-A510 energy-saving cores with 2.2 GHz. LPDDR5 RAM can be used as RAM and UFS 4.0 is supported as internal memory.
Compared to the predecessor MediaTek Dimensity 8200-Ultra the MediaTek Dimensity 8300-Ultra is said to offer up to 20 percent higher CPU performance and up to 60 percent higher GPU performance. According to the manufacturer, the energy efficiency for CPU and GPU has also improved (+30%/+55%).
In terms of connectivity, dual 5G with a theoretical peak download speed of up to 5.17 GBit/s is available, as well as WiFi 6E and Bluetooth 5.4.
The Mediatek Dimensity 8300-Ultra is a variant of the otherwise identical Mediatek Dimensity 8300 that has been specially adapted for Xiaomi and features improvements to the camera ISP. An Imagiq 980 image processor is responsible for processing the camera data. Video recordings are supported with up to 4K at 60 fps.
The integrated ARM Mali-G615 MC6 graphics unit can control displays with a resolution of up to 2,960 x 1,440 pixels (WQHD+) and a refresh rate of up to 120 Hz. With Full HD+, even up to 180 Hz is possible.
Qualcomm Snapdragon 6s Gen 3
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The Qualcomm Snapdragon 6s Gen 3 (SM6375) is an ARM-based SoC for smartphones and tablets in the upper mid-range segment. Launched in mid-2024, the chip offers two fast ARM Cortex-A78-based cores with up to 2.3 GHz and 6 ARM Cortex-A55-based power cores with up to 2 GHz.
The design of the chip and the technical data are similar to the older Snapdragon 695. The Qualcomm Snapdragon 6s Gen 3 is manufactured using the older 6 nm technology and has a higher maximum clock rate as well as some new features compared to the 695. As a result, the performance in our tests with the Motorola Moto G85 is also slightly higher than the older Snapdragon 695.
The integrated graphics card is the Adreno 619. The 5G modem called Snapdragon X51 achieves a maximum of 2.5 GBit / 0.8 GBit (download/upload) and supports mmWave. The FastConnect 6200 subsystem offers Bluetooth 5.2 and Wi-Fi 5 (8x8 sounding, dual band, 2x2). All important satellite positioning systems such as GPS, QZSS, GLONASS, SBAS, Beidou and Galileo are supported.
The image signal processor for the cameras supports 3 cameras. Up to 108 megapixels are possible with the main camera and the recording of images in HEIC format is also possible.
Model | Qualcomm Snapdragon 695 5G | MediaTek Dimensity 8300-Ultra | Qualcomm Snapdragon 6s Gen 3 |
Codename | Kryo 660 Gold (2x Cortex-A78) / Silver (6x Cortex-A55) | Cortex-A15 / A510 | Kryo 660 Gold (2x Cortex-A78) / Silver (6x Cortex-A55) |
Series | Qualcomm Snapdragon | Qualcomm Snapdragon 6 | |
Clock | 1700 - 2200 MHz | 2200 - 3350 MHz | 2000 - 2300 MHz |
Cores / Threads | 8 / 8 2 x 2.2 GHz ARM Cortex-A78 6 x 1.7 GHz ARM Cortex-A55 | 8 / 8 3.4 GHz 4 x 3.2 GHz ARM Cortex-A715 4 x 2.2 GHz ARM Cortex-A510 | 8 / 8 2 x 2.3 GHz ARM Cortex-A78 6 x 2.0 GHz ARM Cortex-A55 |
Technology | 6 nm | 4 nm | 6 nm |
Features | Adreno 619 GPU, X51 5G Modem, Hexagon 692 DSP, Spectra 355L ISP, FastConnect 6200 (Wi-Fi 5) | ARM Mali-G610 MC6 GPU, Dual 5G modem, WiFi 6E, Bluetooth 5.3, H.264/HEVC video decoding | Adreno 619 GPU, X51 5G Modem, Hexagon 692 DSP, Spectra 355L ISP, FastConnect 6200 (Wi-Fi 5) |
iGPU | Qualcomm Adreno 619 | ARM Mali-G615 MP6 | Qualcomm Adreno 619 |
Architecture | ARM | ARM | ARM |
Announced | |||
Manufacturer | www.qualcomm.com | www.mediatek.com | www.qualcomm.com |
L3 Cache | 4 MB |
Benchmarks
Average Benchmarks Qualcomm Snapdragon 695 5G → 100% n=20
Average Benchmarks MediaTek Dimensity 8300-Ultra → 247% n=20
Average Benchmarks Qualcomm Snapdragon 6s Gen 3 → 119% n=20

* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation