AMD Ryzen 7 PRO 6850HS vs AMD Ryzen 7 6800HS
AMD Ryzen 7 PRO 6850HS
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The AMD Ryzen 7 PRO 6850HS is a processor for big (workstation) laptops based of the Rembrandt generation. The R7 6850HS integrates all eight cores based on the Zen 3+ microarchitecture. They are clocked at 3.2 (guaranteed base clock) to 4.7 GHz (Turbo) and support SMT / Hyperthreading (16 threads). The chip is manufactured on the modern 6 nm TSMC process. The HS variant offers a 10 W reduced TDP and therefore a lower sustained performance than the H version. The 6850HS is the professional version of the consumer R7 6800HS with additional management features and the Microsoft Pluton Security processor.
The new Zen 3+ is a refresh of the Zen 3 architecture and should not offer a lot of changes. The chip itself however, offers a lot of new features, like support for USB 4 (40 Gbps), PCI-E Gen 4, DDR5-4800MT/s or LPDDR5-6400MT/s, WiFi 6E, Bluetooth LE 5.2, DisplayPort 2, and AV1 decode.
The processor performance should be between the old Ryzen 9 5980HS and Ryzen 9 5900HS due to the 4.7 GHz boost clock and similar architecture. However, the new Alder Lake H-series CPUs, like the i7-12800H, should offer a higher performance. The similar R7 6800H (45W) has a higher TDP and therefore should be faster when running long term multi-threaded loads.
A big novelty is the integrated GPU Radeon 680M, that is now based on the RDNA2 architecture and offers 12 CUs at up to 2.2 GHz. It should be the fastest iGPU of all at the time of announcement.
Power consumption
This Ryzen 7 has a default TDP of 35 W (also known as the long-term power limit). Which is way too high to allow it to become a heart of a passively cooled laptop, tablet, mini-PC.
The APU is manufactured on TSMC's 6 nm process leading to great, as of late 2022, energy efficiency.
AMD Ryzen 7 6800HS
► remove from comparison
The AMD Ryzen 7 6800HS is a processor for big (gaming) laptops based of the Rembrandt generation. The R7 6800HS integrates all eight cores based on the Zen 3+ microarchitecture. They are clocked at 3.2 (guaranteed base clock) to 4.7 GHz (Turbo) and support SMT / Hyperthreading (16 threads). The chip is manufactured on the modern 6 nm TSMC process. The HS variant offers a 10 W reduced TDP and therefore a lower sustained performance than the H version.
The new Zen 3+ is a refresh of the Zen 3 architecture and should not offer a lot of changes. The chip itself however, offers a lot of new features, like support for USB 4 (40 Gbps), PCI-E Gen 4, DDR5-4800MT/s or LPDDR5-6400MT/s, WiFi 6E, Bluetooth LE 5.2, DisplayPort 2, and AV1 decode.
The processor performance should be between the old Ryzen 9 5980HS and Ryzen 9 5900HS due to the 4.7 GHz boost clock and similar architecture. However, the new Alder Lake H-series CPUs, like the i7-12800H, should offer a higher performance. The similar R7 6800H (45W) has a higher TDP and therefore should be faster when running long term multi-threaded loads.
A big novelty is the integrated GPU Radeon 680M, that is now based on the RDNA2 architecture and offers 12 CUs at up to 2.2 GHz. It should be the fastest iGPU at the time of announcement.
Power consumption
This Ryzen 7 has a default TDP of 35 W (also known as the long-term power limit). Which is definitely too high to allow for passively cooled designs.
The APU is built with TSMC's 6 nm process making for great, as of early 2023, energy efficiency.
Model | AMD Ryzen 7 PRO 6850HS | AMD Ryzen 7 6800HS | ||||||||||||||||||||||||||||||||||||||||||||||||
Series | AMD Rembrandt (Zen 3+) | AMD Rembrandt (Zen 3+) | ||||||||||||||||||||||||||||||||||||||||||||||||
Codename | Rembrandt-HS (Zen 3+) | Rembrandt-HS (Zen 3+) | ||||||||||||||||||||||||||||||||||||||||||||||||
Series: Rembrandt (Zen 3+) Rembrandt-HS (Zen 3+) |
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Clock | 3200 - 4700 MHz | 3200 - 4700 MHz | ||||||||||||||||||||||||||||||||||||||||||||||||
L1 Cache | 512 KB | 512 KB | ||||||||||||||||||||||||||||||||||||||||||||||||
L2 Cache | 4 MB | 4 MB | ||||||||||||||||||||||||||||||||||||||||||||||||
L3 Cache | 16 MB | 16 MB | ||||||||||||||||||||||||||||||||||||||||||||||||
Cores / Threads | 8 / 16 | 8 / 16 | ||||||||||||||||||||||||||||||||||||||||||||||||
TDP | 35 Watt | 35 Watt | ||||||||||||||||||||||||||||||||||||||||||||||||
Technology | 6 nm | 6 nm | ||||||||||||||||||||||||||||||||||||||||||||||||
max. Temp. | 95 °C | 95 °C | ||||||||||||||||||||||||||||||||||||||||||||||||
Socket | FP7/FP7r2 | FP7/FP7r2 | ||||||||||||||||||||||||||||||||||||||||||||||||
Features | DDR5-4800/LPDDR5-6400 RAM (incl. ECC), PCIe 4, PRO, MMX, SSE, SSE2, SSE3, SSSE3, SSE4A, SSE4.1, SSE4.2, AVX, AVX2, BMI2, ABM, FMA, ADX, SMEP, SMAP, SMT, CPB, AES-NI, RDRAND, RDSEED, SHA, SME | DDR5-4800/LPDDR5-6400 RAM (incl. ECC), PCIe 4, MMX, SSE, SSE2, SSE3, SSSE3, SSE4A, SSE4.1, SSE4.2, AVX, AVX2, BMI2, ABM, FMA, ADX, SMEP, SMAP, SMT, CPB, AES-NI, RDRAND, RDSEED, SHA, SME | ||||||||||||||||||||||||||||||||||||||||||||||||
iGPU | AMD Radeon 680M ( - 2200 MHz) | AMD Radeon 680M ( - 2200 MHz) | ||||||||||||||||||||||||||||||||||||||||||||||||
Architecture | x86 | x86 | ||||||||||||||||||||||||||||||||||||||||||||||||
Announced | ||||||||||||||||||||||||||||||||||||||||||||||||||
Manufacturer | www.amd.com | www.amd.com |