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Peladn updates the HO5 mini PC with AMD Zen 5 Ryzen AI 9 HX 470 and OCuLink connectivity

Peladn has announced a new variant of the HO5 mini PC built around AMD’s latest Ryzen AI 9 HX 470 processor.
ⓘ Peladn
Peladn has announced a new variant of the HO5 mini PC built around AMD’s latest Ryzen AI 9 HX 470 processor.
Peladn has launched the HO5 mini PC with AMD's Ryzen AI 9 HX 470 processor, a Zen 5 chip with 12 cores, 24 threads, and Radeon 890M graphics delivering up to 80 TOPS of AI performance, set for global release in late June 2026 at $1,299.

Peladn has announced its new HO5 mini PC, featuring AMD's Ryzen AI 9 HX 470 processor. The company also recently announced another new mini-PC called the YO2. The H05 is set for a global release in late June 2026 with a retail price of $1,299.

This latest model follows a steady stream of hardware releases from the manufacturer over the past several months. Earlier this year, we reviewed a version of the Peladn HO5 mini-PC powered by AMD's Strix Point platform. In the months leading up to that, Peladn released the WO-4, which was equipped with a slower AMD Ryzen APU.

The new HO5 is underpinned by the Ryzen AI 9 HX 470 chip, built on AMD’s Zen 5 architecture. The processor features 12 cores and 24 threads, along with an integrated Radeon 890M graphics solution with 16 compute units. The hardware offers a combined performance rating of up to 80 TOPS for AI tasks, enabling users to natively run large language models and localized productivity tools rather than relying on cloud services.

AMD’s Ryzen AI 9 HX 470 Lands in Peladn’s HO5 Mini PC.

As for memory, you get 32GB of DDR5 RAM and a 1TB PCIe SSD. There’s a secondary M.2 Gen4 slot for storage expansion. Peladn also included an OCuLink port on the chassis to complement the integrated Radeon 890M graphics. The port enables connection to an external GPU dock, allowing users to upgrade the graphics performance to desktop-class standards when needed. This focus on external graphics support follows the company's recent launch of the Link S-3 eGPU dock, which features Thunderbolt 5 connectivity.

Physical connectivity on the device includes WiFi 7, Bluetooth 5.4, dual 2.5GbE Ethernet ports, and USB4 interfaces. Cooling for the internal components is managed by the company's IceBlast 2.0 thermal system, which uses three copper heatpipes, a multi-blade fan, and a high-density heatsink. The chassis also features a geometric design accented by a customizable RGB lighting element on the top panel.

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> Expert Reviews and News on Laptops, Smartphones and Tech Innovations > News > News Archive > Newsarchive 2026 06 > Peladn updates the HO5 mini PC with AMD Zen 5 Ryzen AI 9 HX 470 and OCuLink connectivity
Antony Muchiri, 2026-06-14 (Update: 2026-06-14)