Mediatek Helio G25 vs Qualcomm Snapdragon 626 vs Qualcomm Snapdragon 435

Mediatek Helio G25

The Mediatek Helio G25 is an entry level ARM SoC for smartphones (mainly Android based) that was introduced in late 2020. It is manufactured in a 12 nm FinFET process and is equipped with 8 ARM Cortex-A53 CPU cores divided in two clusters. A performance cluster with 4 cores clocked at up to 2 GHz and a efficiency cluster clocked at up to 1.5 GHz. Compared to the similar Helio A25, the G25 clocks the GPU (+50 MHz) and the CPU cores higher (+200 MHz).

Furthermore, the SoC integrates a LTE Cat.4 modem, a LPDDR3-933 / LPDDR4-1200 / LPDDR4x-1600 memory controller, a IMG PowerVR GE8320 graphics card and a 1080p30 video de- and encoder (H.265 decoding, H.264 encoding).

Qualcomm Snapdragon 626

The Qualcomm Snapdragon 626 (SD626) is a mid-range octa-core SoC with eight ARM Cortex-A53 cpu cores at up to 2.2 GHz, an Adreno 506 GPU, a DDR3L-1866 memory controller and a X9 LTE (Cat 7, 4G+, 300 Mbps down, 150 Mbps up) modem. Furthermore, the chip supports 802.11ac WiFi and Bluetooth 4.1. It is manufactured in 14nm FinFet. The processor performance should be a bit higher than the average Snapdragon 625, due to the 200 MHz higher maximum clock speed.

Qualcomm Snapdragon 435

The Qualcomm Snapdragon 435 (SD435) is a lower mainstream SoC for (Android based) smartphones and tablets. Contrary to the Snapdragon 630, it is still manufactured in a 28-nm process and also consists of an octa-core CPU part with ARM Cortex-A53 cores. However, they are only clocked at up to 1.4 GHz. The integrated X9 LTE modem supports Cat. 4 with maximum transfer rates of 300 Mbps (downstream) and 100 Mbps (upstream). The SoC also includes an Adreno 505 GPU with support for Vulkan and OpenGL ES 3.1. WiFi 802.11ac and Bluetooth 4.1 are supported as well. The memory controller supports LPDDR3 clocked at 800 MHz (so probably dual-channel DDRL-1600). The main difference to the Snapdragon 430 is the faster LTE modem.