A few days ago, we reported that MediaTek and Qualcomm would beat Apple in the race to 3 nm architecture. Before that, however, a 4 nm process will arrive, and it appears MediaTek will be the first to that, beating Qualcomm to the punch in the process.
According to new reports, MediaTek is gearing up to launch a flagship SoC later this year. That chipset will supposedly be used on devices priced upwards of US$600, and could offer performance that matches Qualcomm's best.
While the company's current offerings deliver great performance, MediaTek looks to be a generation behind in terms of flagship SoC performance, with the new Dimensity 1200 being more on par with the Snapdragon 870 than the Snapdragon 888. The new chipset will be built on a 4 nm TSMC node, it appears. MediaTek's current champ, the Dimensity 1200, is built on TSMC's 6 nm process.
As previously mentioned, this new chipset is intended to be used on premium devices, as opposed to sub-premium phones as we've seen with recent Dimensity series offerings. It remains to be seen, however, if MediaTek's reputation in the market has healed enough to compete in that segment.
Buy the MediaTek Dimensity 700-powered Realme Narzo 30 on Amazon.