MediaTek Dimensity 9200+ vs Qualcomm Snapdragon 695 5G vs MediaTek Dimensity 8200-Ultra

MediaTek Dimensity 9200+

The MediaTek Dimensity 9200+ (9200 Plus) is a high-end SoC with an integrated 5G and Wi-Fi 7 modem. It includes one fast Cortex-X3 core with up to 3.35 GHz, three more A715 cores with up to 3 GHz and four power efficiency cores (Cortex-A510) with up to 2 GHz. The SoC is manufactured in the 2nd generation of the 4nm process at TSMC. All CPU cores can together use 8 MB of level 3 cache and 6 MB of System Level Cache (SLC).

Compared to the Dimensity 9200, the Plus model offers an increased peak performance of the CPU and GPU. The CPU clusters all offer higher clock speeds and also the Immortalis-G715 offers a 17% higher clock. Mediatek state, that this leads to a 10% higher CPU and GPU performance.

The integrated memory controller now supports LPDDR5X with 8533 Mbps. AI workloads can be accelerated with the APU 680.

The Dimensity 9200+ is manufactured in the modern 2nd generation 4nm process at TSMC.

Qualcomm Snapdragon 695 5G

The Qualcomm Snapdragon 695 5G (SD695) is a fast mid-range ARM-based SoC largely found on Android tablets and smartphones. It features 8 Kryo 660 called cores (64-Bit capable) that are divided in two clusters. A fast cluster of two cores with up to 2.2 GHz based on the ARM Cortex-A78 design. And a power saving efficiency cluster with up to 1.7 GHz based on much smaller ARM Cortex-A55 cores. Both clusters can also used together.

In addition to the 8 CPU cores, the SoC integrates a lower mid range Adreno 619 GPU, a X51 5G radio (up to 2.5 Gbits download, no mmWave), a 802.11ac (Wi-Fi 5, 8x8 sounding, Dual Band, 2x2), a Bluetooth 5.2 radio, satellite positioning (GPS, QZSS, GLONASS, SBAS, Beidou and Galileo) and a video engine (support for H.265, H.264, VP8 and VP9).

Compared to the previous SD690, the SD695 is now manufactured in 6nm (instead of 8nm) and offers a higher clocked performance cluster. However, the SD695 only supports Wi-Fi 5 instead of Wi-Fi 6 of the SD690.

MediaTek Dimensity 8200-Ultra

The MediaTek Dimensity 8200-Ultra is a upper mid-range ARM-based SoC (system-on-a-chip) that is manufactured using the modern 4 nm process. It was specially designed for use in Android smartphones and is in the upper class in terms of performance. It supports all current mobile communication standards, including 5G SA. 

The CPU works with a total of eight cores, which are divided into two clusters. In the first cluster, an ARM Cortex-A78 power core clocked at 3.1 GHz is joined by three further ARM Cortex-A78 power cores clocked at 3 GHz. In the second cluster, four ARM Cortex-A55 power cores operate at 2.0 GHz. LPDDR5 RAM can be used as RAM and UFS 3.1 is supported as internal memory. 

In terms of connectivity, dual 5G with a theoretical peak download speed of up to 4.7 GBit/s is available, as well as WiFi 6E and Bluetooth 5.3.

The Mediatek Dimensity 8200-Ultra is a variant of the otherwise identical Mediatek Dimensity 8200 that has been specially customised for Xiaomi and features improvements to the camera ISP. An Imagiq 785 image processor is responsible for processing the camera data. Video recordings are supported with up to 4K at 60 fps. The CPU part of the older Dimensity 8100 is very similar and offers the same CPU and GPU cores.

The integrated ARM Mali-G610 MC6 graphics unit can power displays with a resolution of up to 2,960 x 1,440 pixels (WQHD+) and a refresh rate of up to 120 Hz. With Full HD+, even up to 180 Hz is possible.