MediaTek Dimensity 7300X vs Qualcomm Snapdragon 860
MediaTek Dimensity 7300X
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The MediaTek Dimensity 7300 is an ARM-based mid-range SoC for (mostly Android based) smartphones. The integrated CPU is divided into two clusters with four larger ARM Cortex-A78 cores with up to 2.5 GHz clock speed and an efficiency cluster with four ARM Cortex-A55 cores with up to 2 GHz. Compared to the Dimensity 7300, the 7300X is intended for devices for multiple displays like foldable smartphones.
In addition to the integrated ARM Mali-G615 MC2 iGPU, the 7300 also offers a MediaTek APU 655 for AI tasks. Furthermore, a 5G multi-mode modem is installed (2G - 5G) with up to 3.27 Gbps download speed. In addition to Wi-Fi 6E, Bluetooth 5.4 is also supported.
The chip is manufactured using the modern 4nm process and is advertised to consume 25% less power compared to the older Dimensity 7050.
Qualcomm Snapdragon 860
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The Qualcomm Snapdragon 860 (SM8150-AC) Mobile Platform is a high-end smartphone and tablet SoC that Qualcomm announced in 2021. Compared to the old Snapdragon 855 Plus, the 860 is very similar and adds support for 16 GB RAM and a few camera features.
The SoC integrates a fast ‘Prime Core’ that clocks up to 2.96 GHz (up from 2.84 GHz in the 855) and three further fast ARM Cortex-A76 performance cores, which can reach up to 2.42 GHz. These are complemented by four power-saving ARM Cortex-A55 cores that clock up to a maximum of 1.8 GHz.
The SoC also integrates the X24 LTE modem that Qualcomm promises will deliver up to 2 Gbit/s maximum download speed over LTE Cat.20 and up to 316 Mbit/s upload speeds. The Snapdragon 860 can be configured with the company’s new X50 5G modem too (as an external chip).
The integrated Wi-Fi modem, which is Wi-Fi 6-ready, has 8x8 Sounding and supports up to 802.11 ay Wi-Fi. The Wi-Fi modem can utilise the 60 GHz mmWave band for up to 10 Gbit/s internet speeds.
The Hexagon 690 DSP incorporates a neural processing unit (NPU) with dedicated Tensor-cores that can execute up to 7 trillion operations per second in conjunction with the CPU and GPU. In short, the Snapdragon 860 should be three times faster than the Snapdragon 845 and two times faster than the Kirin 980 SoC.
The Snapdragon 860 also has a Spectra 380 ISP onboard, which was the world’s first part to incorporate a Computer Vision Engine (CV-ISP) that can perform depth calculations in videos at up to 60 FPS. The Snapdragon 860 should deliver real-time portrait modes or be able to detect objects with relatively low power consumption.
The built-in memory controller supports up to 16 GB LPDDR4x RAM (4 x 16-bit). As the SD855 and 855+, the 860 integrates an Adreno 640 graphics card.
Qualcomm will manufacturer the Snapdragon 860 at the Taiwan Semiconductor Manufacturing Company (TSMC) using a 7 nm FinFET process.
| Model | MediaTek Dimensity 7300X | Qualcomm Snapdragon 860 | ||||||||||||
| Codename | Cortex-A78 / A55 | Cortex-A76 / A55 (Kryo 485) | ||||||||||||
| Clock | 2000 - 2500 MHz | <=2960 MHz | ||||||||||||
| Cores / Threads | 8 / 8 4 x 2.5 GHz ARM Cortex-A78 4 x 2.0 GHz ARM Cortex-A55 | 8 / 8 | ||||||||||||
| Technology | 4 nm | 7 nm | ||||||||||||
| iGPU | ARM Mali-G615 MP2 | Qualcomm Adreno 640 (250 - 675 MHz) | ||||||||||||
| Architecture | ARM | ARM | ||||||||||||
| Announced | ||||||||||||||
| Manufacturer | www.mediatek.com | www.qualcomm.com | ||||||||||||
| Series | Qualcomm Snapdragon | |||||||||||||
| Series: Snapdragon Cortex-A76 / A55 (Kryo 485) |
| |||||||||||||
| L2 Cache | 1.8 MB | |||||||||||||
| L3 Cache | 5 MB | |||||||||||||
| TDP | 5 Watt | |||||||||||||
| Features | X24 LTE Modem, Adreno 640 GPU |
Benchmarks
Average Benchmarks MediaTek Dimensity 7300X → 100% n=15
Average Benchmarks Qualcomm Snapdragon 860 → 85% n=15
- Average benchmark values for this graphics card* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation
