MediaTek Dimensity 7300 vs Mediatek Helio G96 vs MediaTek Dimensity 8100
MediaTek Dimensity 7300
► remove from comparison
The MediaTek Dimensity 7300 is an ARM-based mid-range SoC for (mostly Android based) smartphones. The integrated CPU is divided into two clusters with four larger ARM Cortex-A78 cores with up to 2.5 GHz clock speed and an efficiency cluster with four ARM Cortex-A55 cores with up to 2 GHz.
In addition to the integrated ARM Mali-G615 MC2 iGPU, the 7300 also offers a MediaTek APU 655 for AI tasks. Furthermore, a 5G multi-mode modem is installed (2G - 5G) with up to 3.27 Gbps download speed. In addition to Wi-Fi 6E, Bluetooth 5.4 is also supported.
The chip is manufactured using the modern 4nm process and is advertised to consume 25% less power compared to the older Dimensity 7050.
Mediatek Helio G96
► remove from comparison
The Mediatek Helio G96 is a mainstream ARM SoC for smartphones (mainly Android based) that was introduced in 2021. It is manufactured in a 12 nm FinFET process and is equipped with 2x big ARM Cortex-A76 cores with up to 2.05 GHz and 6x small and power efficient ARM Cortex-A55 cores (max. 2 GHz) in two clusters (bigLITTLE). The chip integrates an ARM Mali-G57 MC2 (two cores) clocked at up to 950 MHz. Compared to the similar Helio G95, the G96 offers a slower GPU but supports 120 Hz displays (G95 90 Hz).
Furthermore, the integrated LTE modem supports Cat-12 600 Mbps download and Cat-13 150 Mbps upload speeds. Wi-Fi 5 is also integrated (a/b/g/n/ac). The memory controller supports LPDDR3 and LPDDR4x with up to 2,133 MHz with up to 10 GB capacity.
MediaTek Dimensity 8100
► remove from comparison
The Mediatek Dimensity 8100 is a upper mid-range smartphone SoC. The CPU integrates four fast ARM Cortex-A78 cores with up to 2.85 GHz and four efficient Cortex-A55 cores with up to 2 GHz. The integrated 5G modem supports all modern standards including 5G SA and a maximum download speed of 4.7 Gbps.
The integrated ARM Mali-G610 MC6 GPU integrates 6 cores and supports displays with up to 2,960 x 1,440 pixels (WQHD+).
The chip is produced at TSMC in 5nm.
Model | MediaTek Dimensity 7300 | Mediatek Helio G96 | MediaTek Dimensity 8100 | ||||||||||||||||||||
Codename | Cortex-A78 / A55 | Cortex-A76 / A55 | Cortex-A78 / A55 | ||||||||||||||||||||
Clock | 2000 - 2500 MHz | 2000 - 2050 MHz | 2000 - 2850 MHz | ||||||||||||||||||||
Cores / Threads | 8 / 8 4 x 2.6 GHz ARM Cortex-A78 4 x 2.0 GHz ARM Cortex-A55 | 8 / 8 2 x 2.1 GHz ARM Cortex-A76 6 x 2.0 GHz ARM Cortex-A55 | 8 / 8 | ||||||||||||||||||||
Technology | 4 nm | 12 nm | 6 nm | ||||||||||||||||||||
iGPU | ARM Mali-G615 MP2 | ARM Mali-G57 MP2 ( - 950 MHz) | ARM Mali-G610 MP6 | ||||||||||||||||||||
Architecture | ARM | ARM | ARM | ||||||||||||||||||||
Announced | |||||||||||||||||||||||
Manufacturer | www.mediatek.com | www.mediatek.com | www.mediatek.com | ||||||||||||||||||||
Series | Mediatek Mediatek Helio G | ||||||||||||||||||||||
Series: Mediatek Helio G Cortex-A76 / A55 |
| ||||||||||||||||||||||
Features | 2x Cortex-A76, 6x Cortex-A55, 4G LTE Cat-12/13, 64MP AI-Camera support, LPDDR3/LPDDR4x-2133, eMMC 5.1, UFS 2.1, Beidou, Galileo, Glonass, GPS, Wi-Fi 5 (a/b/g/n/ac), AI Accelerator up to 1 TMACs, H.264 / H.265 / HEVC video encoding (4k30) | 4x ARM Cortex-A77 (2.85 GHz), 4x ARM Cortex-A55 (2 GHz), ARM Mali-G610 MC6, APU 580, 5G Modem, MiraVision 780, Wi-Fi 6E, Bluetooth 5.3, UFS 3.1, LPDDR5 |
Benchmarks
Average Benchmarks MediaTek Dimensity 7300 → 100% n=12
Average Benchmarks Mediatek Helio G96 → 62% n=12
Average Benchmarks MediaTek Dimensity 8100 → 111% n=12

* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation