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Bendable non-silicon RISC-V microprocessor with under-a-dollar manufacturing cost could be a game-changer for smart sensors and wearables

Researchers claim that this will be a huge step-up for the possibilities of flexible electronic systems. (Image source: Pragmatic)
Researchers claim that this will be a huge step-up for the possibilities of flexible electronic systems. (Image source: Pragmatic)
The newly developed Flex-RV microprocessor, made with flexible IGZO TFTs and based on RISC-V architecture, operates at 60 kHz with under 6 mW power consumption. Its bendability and low-cost design make it ideal for wearables, healthcare devices, and smart sensors.

Researchers have developed Flex-RV, a game-changing flexible microprocessor based on the RISC-V architecture and fabricated with indium gallium zinc oxide (IGZO) thin-film transistors (TFTs). This contraption (literally) moves beyond conventional silicon-based semiconductors - and what we have is a sub-dollar solution for low-power, bendable computing.

Flex-RV operates at 60 kHz with a power consumption of less than 6 mW, showing only a 4.3% performance variation even under tight bending conditions, thanks to its flexible polyimide substrate. Polyimide is specifically used as a substrate in this use-case because of its excellent thermal stability, high mechanical strength, and resistance to chemicals.

The processor integrates a programmable machine learning (ML) hardware accelerator, capable of executing ML workloads through custom RISC-V instructions. This feature supports on-chip AI computations, which means Flex-RV could be ideal for emerging applications such as healthcare wearables, smart packaging, and fast-moving consumer goods - especially where cost-effectiveness and form factor are critical. The computational requirements in these sectors are typically low, and Flex-RV meets these demands while offering flexibility and durability.

The fabrication process, which leverages IGZO TFTs, drastically lowers environmental impact compared to silicon-based counterparts, especially at sub-micron dimensions. Additionally, the over-edge printing (OEP) assembly method ensures that the Flex-RV die can be mounted onto flexible printed circuit boards (FlexPCBs) and maintain operational integrity during mechanical stress tests, withstanding a 3 mm bending radius - pretty significant for a component of that size.

Given its ultra-low cost, flexible design, and ML scope, Flex-RV could become mainstream in the future - a vital technology for next-generation wearable electronics, implantable medical devices, and smart sensors.

The FlexPCB (Flexible Printed Circuit Board) on which the die is assembled, which is further connected to the FPGA board. (Image source: Nature / Pragmatic Semi)
The FlexPCB (Flexible Printed Circuit Board) on which the die is assembled, which is further connected to the FPGA board. (Image source: Nature / Pragmatic Semi)
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> Expert Reviews and News on Laptops, Smartphones and Tech Innovations > News > News Archive > Newsarchive 2024 09 > Bendable non-silicon RISC-V microprocessor with under-a-dollar manufacturing cost could be a game-changer for smart sensors and wearables
Anubhav Sharma, 2024-09-30 (Update: 2024-09-30)