CES 2023 | AMD introduces Instinct MI300 exascale APU combining Zen 4 EPYC cores with CDNA 3 GPGPU cores and up to 128 GB HBM3 memory

AMD already proved that 3D stacking works wonders for processors with the 3D V-Cache design on the Ryzen 7 5800X3D, and, just yesterday, this technology got introduced for the desktop Ryzen 7000 processor family, as well. Team Red seems to be looking to apply the 3D stacking technique to other product ranges in its portfolio, as CEO Lisa Su also presented the next gen Instinct MI300 datacenter / HPC GPU that will also stack CPU cores and HBM3 memory on the same APU.

During the CES 2023 keynote, CEO Lisa Su revealed that the MI300 APUs will combine up to 24 Zen 4 EPYC cores with CDNA 3 (GX940) GPGPU cores plus up to 128 GB of HBM3 integrated memory. This configuration does not require external RAM for the CPU cores. The MI300 APU itself will be AMD’s first attempt at a 3D package design with nine 5 nm chiplets  stacked over four 6 nm chiplets. This model is currently being tested in AMD’s labs and should be ready for launch some time in the second half of 2023.

As pointed out by Videocardz, apart from the 3D design with two chiplet layers, the MI300 will also integrate 146 billion transistors plus up to 8 compute tiles, while the HBM3 cluster will be complemented by a memory bus with a maximum of 8192 bits, and the power rating for this chip is expected to hover around 600 W.

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