The Mediatek Dimensity 800 is a fast mid-range SoC with an integrated 5G modem. It includes four fast ARM Cortex-A76 cores at up to 2 GHz and four power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 4 core ARM Mali-G57 MC4 GPU, a Wi-fi 5 modem, a LPDDR4x memory controller(up to 16 GB with 2133 MHz), a AI processing unit (APU 3.0) and video de- and encoding.
Compared to the similar named Dimensity 800U, the 800 offers two more big A76 cores but clocked 400 MHz lower. This means the single core performance is lower, but the multi-core performance can be better.
The Dimensity 800 is manufactured in the modern 7nm process and should be very power efficient.
The Unisoc T760 Tanggula (former Spreadtrum) is a mid range SoC for Android based smartphones and tablets. It integrates an octa-core CPU with two clusters. Four fast ARM Cortex-A76 cores clocked at up to 2 GHz and four small ARM-Cortex-A55 cores at again up to 2 GHz for efficiency. The faster T770 SoC offers higher clocked A76 cores in comparison (up to 2.5 GHz for a single core).
One fast ARM Cortex-A76 clocked at up to 2.5 GHz, three more A76 performance cores clocked at up to 2.2 GHz and a power efficiency cluster of four ARM-Cortex-A55 cores with up to 2 GHz. The integrated memory controller supports LPDDR4/4X with up to 2133 MHz (2x 16 Bit). The integrated ISP supports two main cameras and two subsidiary cameras (up to 108 MPix). The integrated graphics card is an ARM Mali-G57 MC4 (4 cores) at up to 780 MHz. Unisoc also specifies that the T770 offers hardware AI acceleration.
The chip is manufactured in the modern 6nm process.
The Mediatek Dimensity 700 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A76 cores at up to 2.2 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Compared to the similar Dimensity 800U, the 700 offers lower clocked CPU cores (-200 MHz) and a slower GPU (one less core).
Furthermore, the chip integrates a 2 core ARM Mali-G57 MC2 GPU, a Wi-fi 5 modem, a LPDDR4x-2133 memory controller, a AI processing unit (APU 3.0) and video de- and encoding.
The Dimensity 700 is manufactured in the modern 7nm process and should be very power efficient.
Average Benchmarks MediaTek Dimensity 800 → 100%n=2
Average Benchmarks UNISOC Tangula T760 → 102%n=2
Average Benchmarks MediaTek Dimensity 700 → 92%n=2
- Range of benchmark values for this graphics card - Average benchmark values for this graphics card * Smaller numbers mean a higher performance 1 This benchmark is not used for the average calculation
v1.26
log 19. 15:57:27
#0 checking url part for id 13001 +0s ... 0s
#1 checking url part for id 14027 +0s ... 0s
#2 checking url part for id 13199 +0s ... 0s
#3 not redirecting to Ajax server +0s ... 0s
#4 did not recreate cache, as it is less than 5 days old! Created at Sun, 19 May 2024 05:35:32 +0200 +0.001s ... 0.001s
#5 composed specs +0.122s ... 0.123s
#6 did output specs +0s ... 0.123s
#7 getting avg benchmarks for device 13001 +0.013s ... 0.136s
#8 got single benchmarks 13001 +0.009s ... 0.145s
#9 getting avg benchmarks for device 14027 +0.003s ... 0.148s
#10 got single benchmarks 14027 +0.005s ... 0.153s
#11 getting avg benchmarks for device 13199 +0.01s ... 0.164s
#12 got single benchmarks 13199 +0.06s ... 0.223s
#13 got avg benchmarks for devices +0s ... 0.223s
#14 min, max, avg, median took s +0.115s ... 0.338s