Qualcomm’s Snapdragon 845 is expected to be officially announced this December, but bits and pieces about the chip’s performance and specs have been circulating on the web for a few months now. We already know the flagship chip is supposed to be built on the 10 nm Low Power Early process in the TSMC foundries. This will probably just improve the power requirements, while the real performance boost should be coming from the third generation Kryo cores.
According to the latest rumors, Snapdragon 845 would include four Kryo cores based on ARM’s Cortex-A75 processors. These are most likely to be paired with an additional four A53 cores for efficiency. Graphics-wise, the SoC will integrate the new Adreno 630 GPU that brings VR and AR optimizations. Qualcomm seems to be guarding this GPU well, as we have not seen any leaked benchmarks for the time being. There will also be support for dual 25 MP cameras for front and back, and the X20 mobile model will boost the speeds into the 5G range, with a theoretical 1.2 Gbps downlink.
Some of the devices that will be powered by the Snapdragon 845 include the Galaxy S9 from Samsung, and the Xiaomi Mi7, both expected in early 2018. There is a strong possibility that the upcoming LG flagships could get the Snapdragon 845 treatment, as well.
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