UNISOC T750 vs MediaTek Dimensity 6100+

UNISOC T750

The Unisoc T750 (Tanggula, former Spreadtrum) is a mid range SoC for Android based smartphones and tablets. It integrates an octa-core CPU with two clusters. Two fast ARM Cortex-A76 cores clocked at up to 2 GHz and six small ARM-Cortex-A55 cores at again up to 1.8 GHz for efficiency. The faster T760 SoC offers two more A76 cores, a faster GPU and a faster memory controller.

The integrated memory controller supports LPDDR4X with up to 1866 MHz. The integrated ISP supports two main cameras (up to 64 MPix). The integrated graphics card is an ARM Mali-G57 MC2 (2 cores) at up to 680 MHz. The integrated modem supports Wi-Fi 5 WLAN, 5G (TDD+FDD CA Sub-6GHz), and Cat15DL / Cat18 UL LTE.

The chip is manufactured in the modern 6nm process.

MediaTek Dimensity 6100+

The Mediatek Dimensity 6100+ (or 6100 Plus, MT6835V/ZA) is a lower mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A76 cores at up to 2.2 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). The specifications are similar to the old Dimensity 700 SoC and nearly identical to the Dimensity 6020. Compared to the 6020, the 6100+ offers slightly higher 5 G speeds (3.3 vs 2.7 Gbps), Bluetooth 5.2 (vs 5.1) support, and is manufactured in the slightly improved 6nm process (vs 7nm).

Furthermore, the chip integrates a 2 core ARM Mali-G57 MC2 GPU, a Wi-fi 5 modem, a LPDDR4x-2133 memory controller, a AI processing unit (APU 3.0) and video de- and encoding.