Qualcomm Snapdragon 8+ Gen 1 vs Apple M1 Pro 8-Core vs Qualcomm Snapdragon 8 Gen 1

Qualcomm Snapdragon 8+ Gen 1

The Qualcomm Snapdragon 8+ Gen 1 Mobile Platform is a high-end SoC for smartphones that was introduced in mid 2022 and manufactured in 4 nm at TSMC. It integrates one “Prime Core” based on a ARM Cortex-X2 architecture clocked at up to 3.2 GHz. Three more performance cores are based on the Cortex-A710 but clocked up to 2.5 GHz. Furthermore, four energy saving cores are integrated that are based on the ARM Cortex-A510 architecture and clocked at up to 1.8 GHz. All cores can use the shared 6 MB level 3 cache.

Compared to the Snapdragon 8 Gen 1, the SoC is now produced in the more power efficient 4nm process at TSMC and offers higher clocked CPU and GPU cores (at a lower power consumption according to Qualcomm).

The integrated AI Engine can offer up to 4x faster AI performance thanks to the bigger Tensor engine. The 18-Bit-Spectra-ISP also saw some big improvements and is now called Snapdragon Sight.

The integrated Adreno 730 offers a 30% graphics boost compared to the previous Adreno 660.

The integrated Snapdragon X65 5G modem is also new and offers faster transfer rates (up to 10 Gbps download and 3 Gbps upload). The FastConnect 6900 offers support for the current Wifi 6E and Bluetooth 5.2.

Apple M1 Pro 8-Core

The Apple M1 Pro 8-Core is a System on a Chip (SoC) from Apple that is found in the late 2021 MacBook Pro 14 and 16-inch models. It offers 8 cores from the 10 available in the chip divided in six performance cores (P-cores with 600 - 3220 MHz) and four power-efficiency cores (E-cores with 600 - 2064 MHz). The cores are similar to the cores in the Apple M1.

The big cores (codename Firestorm) offer 192 KB instruction cache, 128 KB data cache, and 24 MB shared L2 cache (up from 12 MB in the M1). The four efficiency cores (codename Icestorm) are a lot smaller and offer only 128 KB instruction cache, 64 KB data cache, and 4 MB shared cache. Finally, the SoC includes 16 MB System Level Cache shared by the GPU. The efficiency cores (E cluster) clock with 600 - 2064 MHz, the performance cores (P cluster) with 600 - 3228 MHz.

The unified memory (16 or 32 GB LPDDR5-6400) next to the chip is connected by a 256 bit memory controller and can be used by the GPU and CPU.

The integrated graphics card in the M1 Pro offers 14 cores (of the 16 cores in the chip).

Furthermore, the SoC integrates a fast 16 core neural engine, a secure enclave (e.g., for encryption), a unified memory architecture, Thunderbolt 4 controller, an ISP, and media de- and encoders (including ProRes).

The M1 Pro is manufactured in 5 nm at TSMC and integrates 33.7 billion transistors. The peak power consumption of the chip was advertised around 30W for CPU intensive tasks.

Qualcomm Snapdragon 8 Gen 1

The Qualcomm Snapdragon 8 Gen 1 Mobile Platform is a high-end SoC for smartphones that was introduced in late 2021 and manufactured in 4 nm at Samsung. Integrates one “Prime Core” based on a ARM Cortex-X2 architecture clocked at up to 3 GHz. Three more performance cores are based on the Cortex-A710 but clocked up to 2.5 GHz. Furthermore, four energy saving cores are integrated that are based on the ARM Cortex-A510 architecture and clocked at up to 1.8 GHz. All cores can use the shared 6 MB level 3 cache.

Compared to the Snapdragon 888 (Plus), the CPU part gains 20% performance and 30% power savings according to Qualcomm. This means that the Snapdragon 8 Gen 1 is the fastest CPU for Android based smartphones and should be positioned between the Apple A13 and A14 CPU.

The integrated AI Engine can offer up to 4x faster AI performance thanks to the bigger Tensor engine. The 18-Bit-Spectra-ISP also saw some big improvements and is now called Snapdragon Sight.

The integrated Adreno 730 offers a 30% graphics boost compared to the previous Adreno 660.

The integrated Snapdragon X65 5G modem is also new and offers faster transfer rates (up to 10 Gbps download and 3 Gbps upload). The FastConnect 6900 offers support for the current Wifi 6E and Bluetooth 5.2.