Google Tensor G6: Pixel 11 SoC could be manufactured on TSMC's 2 nm node

To nobody's surprise, Google's shiny new Tensor G4 is still far behind Qualcomm, Apple and even MediaTek when it comes to raw performance. The company says Tensor chips aren't built to top benchmark charts; not reassuring for people who paid upwards of $1,000 for a Pixel 9 Pro Fold or Pixel 9 Pro XL (curr $1,100 on Amazon). Nevertheless, those holding out for the Tensor G5 powered Pixel 10 series or its successor could be in for a surprise as it is supposed to he Google's first fully in-house SoC.

A report from Business Korea, citing 'industry insiders', states the Tensor G5 could be manufactured on TSMC's 3 nm node (probably N3E). An earlier leak said it has already taped out, so mass production should be in full swing by next year. Its successor, the Tensor G6, will apparently get access to TSMC's cutting-edge 2 nm (N2) node in 2026. The latter seems implausible as Apple/Intel usually get first dibs on a new TSMC node and Google doesn't make nearly as many smartphone APs as Apple.

Hence, it is likely the Tensor G6 will stick with the more mature TSMC N3P node, which is tipped to enter mass production in 2025. Nevertheless, it is still a step up from the Samsung Foundry 4LPP+ node used on the current-gen Tensor G4. In an ideal world, Google would have stuck with Samsung Foundry's 3 nm (and potentially 2 nm) nodes, but the former seems to be afflicted by poor yields, which has, in turn, delayed Samsung's own Exynos 2500 to mid-2025.