MediaTek Dimensity 8100 vs Qualcomm Snapdragon 888 4G vs MediaTek Dimensity 7020
MediaTek Dimensity 8100
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The Mediatek Dimensity 8100 is a upper mid-range smartphone SoC. The CPU integrates four fast ARM Cortex-A78 cores with up to 2.85 GHz and four efficient Cortex-A55 cores with up to 2 GHz. The integrated 5G modem supports all modern standards including 5G SA and a maximum download speed of 4.7 Gbps.
The integrated ARM Mali-G610 MC6 GPU integrates 6 cores and supports displays with up to 2,960 x 1,440 pixels (WQHD+).
The chip is produced at TSMC in 5nm.
Qualcomm Snapdragon 888 4G
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The Qualcomm Snapdragon 888 4G Mobile Platform is a high-end SoC for smartphones that was introduced in mid 2021 and manufactured in 5 nm at Samsung. Compared to the earlier released Snapdragon 888 5G, the 4G variant only features a 4G LTE modem.
The chip integrates one “Prime Core” based on a ARM Cortex-X1 architecture clocked at up to 2.84 GHz. Three more performance cores are based on the A78 but clock up to 2.42 GHz. Furthermore, four energy saving cores are integrated that are based on the ARM Cortex-A55 architecture and clock at up to 1.8 GHz. In addition to the processor cores, the SoC integrates a WiFi 6e modem, a Hexagon 780 DSP (up to 26 TOPS of AI performance) and a Spectra 580 ISP. The integrated memory controller now supports faster LPDDR5 memory with up to 3,200 MHz.
The performance of the processor cores should be around 15% better than the old Snapdragon 865+. The integrated Adreon 660 GPU should make a bigger jump by 35% (most likely compared to the SD 865).
MediaTek Dimensity 7020
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The Mediatek Dimensity 7020 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A78 cores at up to 2.2 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a IMG BXM-8-256 GPU, a Wi-Fi 5 modem, a LPDDR5 / LPDDR4X memory controller, a AI processing unit and video de- and encoding.
The 5G modem supports NR 2CC and mixed duplex (TDD/FDD) and dual SIM. The download speeds can reach up to 2.77 Gbit/s.
Compared to the Dimensity 930, the 7020 offers the same specifications and seems to be a rebrand.
The Dimensity 930 and 7020 are manufactured in the modern 6nm process and should be very power efficient.
Model | MediaTek Dimensity 8100 | Qualcomm Snapdragon 888 4G | MediaTek Dimensity 7020 | ||||||||||||||||
Codename | Cortex-A78 / A55 | Cortex-X1 / A78 / A55 (Kryo 680) | Cortex-A78 / A55 | ||||||||||||||||
Clock | 2000 - 2850 MHz | 1800 - 2840 MHz | 2000 - 2500 MHz | ||||||||||||||||
Cores / Threads | 8 / 8 | 8 / 8 1 x 2.8 GHz ARM Cortex-X1 3 x 2.4 GHz ARM Cortex-A78 4 x 1.8 GHz ARM Cortex-A55 | 8 / 8 2 x 2.2 GHz ARM Cortex-A78 6 x 2.0 GHz ARM Cortex-A55 | ||||||||||||||||
Technology | 6 nm | 5 nm | 6 nm | ||||||||||||||||
Features | 4x ARM Cortex-A77 (2.85 GHz), 4x ARM Cortex-A55 (2 GHz), ARM Mali-G610 MC6, APU 580, 5G Modem, MiraVision 780, Wi-Fi 6E, Bluetooth 5.3, UFS 3.1, LPDDR5 | Adreno 660 GPU, Spectra 580 ISP, Hexagon 780, X60 5G Modem, FastConnect 6900 WiFi,LPDDR5-6400 / LPDDR4X-4266 MHz Memory Controller (64 Bit) | 2x ARM Cortex-A78 (2.2 GHz), 6x ARM Cortex-A55 (2 GHz), PowerVR BXM-8-256, 5G 2CC-CA FDD+TDD, Dual 5G SIM, Dual VoNR, UFS 3.1, LPDDR5 | ||||||||||||||||
iGPU | ARM Mali-G610 MP6 | Qualcomm Adreno 660 | IMG BXM-8-256 | ||||||||||||||||
Architecture | ARM | ARM | ARM | ||||||||||||||||
Announced | |||||||||||||||||||
Manufacturer | www.mediatek.com | www.qualcomm.com | www.mediatek.com | ||||||||||||||||
Series | Qualcomm Snapdragon | ||||||||||||||||||
Series: Snapdragon Cortex-X1 / A78 / A55 (Kryo 680) |
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L3 Cache | 3 MB | ||||||||||||||||||
TDP | 5 Watt |
Benchmarks
Average Benchmarks MediaTek Dimensity 8100 → 100% n=14
Average Benchmarks Qualcomm Snapdragon 888 4G → 90% n=14
Average Benchmarks MediaTek Dimensity 7020 → 77% n=14

* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation