MediaTek Dimensity 8100 vs Qualcomm Snapdragon 6s Gen 3 vs MediaTek Dimensity 7300X
MediaTek Dimensity 8100
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The Mediatek Dimensity 8100 is a upper mid-range smartphone SoC. The CPU integrates four fast ARM Cortex-A78 cores with up to 2.85 GHz and four efficient Cortex-A55 cores with up to 2 GHz. The integrated 5G modem supports all modern standards including 5G SA and a maximum download speed of 4.7 Gbps.
The integrated ARM Mali-G610 MC6 GPU integrates 6 cores and supports displays with up to 2,960 x 1,440 pixels (WQHD+).
The chip is produced at TSMC in 5nm.
Qualcomm Snapdragon 6s Gen 3
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The Qualcomm Snapdragon 6s Gen 3 (SM6375) is an ARM-based SoC for smartphones and tablets in the upper mid-range segment. Launched in mid-2024, the chip offers two fast ARM Cortex-A78-based cores with up to 2.3 GHz and 6 ARM Cortex-A55-based power cores with up to 2 GHz.
The design of the chip and the technical data are similar to the older Snapdragon 695. The Qualcomm Snapdragon 6s Gen 3 is manufactured using the older 6 nm technology and has a higher maximum clock rate as well as some new features compared to the 695. As a result, the performance in our tests with the Motorola Moto G85 is also slightly higher than the older Snapdragon 695.
The integrated graphics card is the Adreno 619. The 5G modem called Snapdragon X51 achieves a maximum of 2.5 GBit / 0.8 GBit (download/upload) and supports mmWave. The FastConnect 6200 subsystem offers Bluetooth 5.2 and Wi-Fi 5 (8x8 sounding, dual band, 2x2). All important satellite positioning systems such as GPS, QZSS, GLONASS, SBAS, Beidou and Galileo are supported.
The image signal processor for the cameras supports 3 cameras. Up to 108 megapixels are possible with the main camera and the recording of images in HEIC format is also possible.
MediaTek Dimensity 7300X
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The MediaTek Dimensity 7300X is an ARM-based mid-range SoC for (mostly Android based) smartphones. The integrated CPU is divided into two clusters with four larger ARM Cortex-A78 cores with up to 2.5 GHz clock speed and an efficiency cluster with four ARM Cortex-A55 cores with up to 2 GHz. Compared to the Dimensity 7300, the 7300X is intended for devices for multiple displays like foldable smartphones.
In addition to the integrated ARM Mali-G615 MC2 iGPU, the 7300 also offers a MediaTek APU 655 for AI tasks. Furthermore, a 5G multi-mode modem is installed (2G - 5G) with up to 3.27 Gbps download speed. In addition to Wi-Fi 6E, Bluetooth 5.4 is also supported.
The chip is manufactured using the modern 4nm process and is advertised to consume 25% less power compared to the older Dimensity 7050.
| Model | MediaTek Dimensity 8100 | Qualcomm Snapdragon 6s Gen 3 | MediaTek Dimensity 7300X |
| Codename | Cortex-A78 / A55 | Kryo 660 Gold (2x Cortex-A78) / Silver (6x Cortex-A55) | Cortex-A78 / A55 |
| Clock | 2000 - 2850 MHz | 2000 - 2300 MHz | 2000 - 2500 MHz |
| Cores / Threads | 8 / 8 | 8 / 8 2 x 2.3 GHz ARM Cortex-A78 6 x 2.0 GHz ARM Cortex-A55 | 8 / 8 4 x 2.5 GHz ARM Cortex-A78 4 x 2.0 GHz ARM Cortex-A55 |
| Technology | 6 nm | 6 nm | 4 nm |
| Features | 4x ARM Cortex-A77 (2.85 GHz), 4x ARM Cortex-A55 (2 GHz), ARM Mali-G610 MC6, APU 580, 5G Modem, MiraVision 780, Wi-Fi 6E, Bluetooth 5.3, UFS 3.1, LPDDR5 | Adreno 619 GPU, X51 5G Modem, Hexagon 692 DSP, Spectra 355L ISP, FastConnect 6200 (Wi-Fi 5) | |
| iGPU | ARM Mali-G610 MP6 | Qualcomm Adreno 619 | ARM Mali-G615 MP2 |
| Architecture | ARM | ARM | ARM |
| Announced | |||
| Manufacturer | www.mediatek.com | www.qualcomm.com | www.mediatek.com |
| Series | Qualcomm Snapdragon 6 |
Benchmarks
Average Benchmarks MediaTek Dimensity 8100 → 100% n=14
Average Benchmarks Qualcomm Snapdragon 6s Gen 3 → 80% n=14
Average Benchmarks MediaTek Dimensity 7300X → 91% n=14
- Average benchmark values for this graphics card* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation
