MediaTek Dimensity 7300 vs Qualcomm Snapdragon 778G+ 5G

MediaTek Dimensity 7300

The MediaTek Dimensity 7300 is an ARM-based mid-range SoC for (mostly Android based) smartphones. The integrated CPU is divided into two clusters with four larger ARM Cortex-A78 cores with up to 2.5 GHz clock speed and an efficiency cluster with four ARM Cortex-A55 cores with up to 2 GHz.

In addition to the integrated ARM Mali-G615 MC2 iGPU, the 7300 also offers a MediaTek APU 655 for AI tasks. Furthermore, a 5G multi-mode modem is installed (2G - 5G) with up to 3.27 Gbps download speed. In addition to Wi-Fi 6E, Bluetooth 5.4 is also supported.

The chip is manufactured using the modern 4nm process and is advertised to consume 25% less power compared to the older Dimensity 7050.

Qualcomm Snapdragon 778G+ 5G

The Qualcomm Snapdragon 778G+ 5G (SDM778G Plus 5G Mobile Platform) is a fast mid-range ARM-based SoC largely found on Android tablets and smartphones. It integrates eight cores (octa-core) divided into two clusters. A fast performance cluster with four cores based on the ARM Cortex-A78 architecture with up to 2.5 GHz and a power efficiency cluster with four small ARM Cortex-A55 cores at up to 1.9 GHz. Depending on the workload only single clusters or all cores can run at different clock speeds. Compared to the older non-plus variant, the 778G+ offers 100 MHz higher clocked CPU cores.

Thanks to the new Cortex-A78 cores, the CPU performance increases by up to 40% compared to the old Snapdragon 768G according to Qualcomm. In our benchmarks, the 778G+ is able to reach the performance of the old high end chip Kirin 990. 

The integrated X53 5G modem supports up to 3.3 Gbps with sub 6Ghz. The FastConnect 6900 Wi-Fi modem supports the current Wi-Fi 6e standard with 6GHz.

The integrated Qualcomm Adreno 642L offers a 40% higher performance compared to the old Adreno 620 in the predecessor. This is partly thanks to the fast memory controller with LPDDR5-3200 support.

The integrated 6th gen AI engine called Hexagon 770 offers a 2x improvement and up to 12 TOPS of performance. The Spectra 570 ISP (image signal processor) supports up to three cameras. The satellite system supports all major standards like Beidou, Galileo, GLONASS and GPS.

The G specifies an optimized SoC for gaming and e.g. Qualcomm offers updates for the graphics driver.

The Snapdragon 778G Plus is manufactured in the modern 6 nm process at TSMC (vs the 5LPE of the 780G).