Qualcomm Snapdragon 617 MSM8952 vs Mediatek Helio G25 vs Mediatek Helio G37

Qualcomm Snapdragon 617 MSM8952

The Qualcomm Snapdragon 617 MSM8952 is a mid-range ARMv8-based SoC largely for Android tablets and smartphones announced in September 2015. In addition to 8 Cortex-A53 CPU cores at up to 1.5 / 1.2 (performance and power saving cluster) GHz, the SoC integrates an Adreno 405 GPU with a LPDDR3-1866 memory controller and supports Wi-Fi (802.11ac), Bluetooth 4.0, UMTS, and LTE. Compared to the older Snapdragon 615, the clock speeds are a bit lower (hits 1.7 GHz max).

CPU

The Cortex-A53 is the successor to the very popular Cortex-A7 design. In addition to the new 64-bit capable ARMv8 ISA, the cores offer a variety of other improvements such as better branch prediction. This leads to a significantly higher performance per clock, which is even above the older Cortex-A9.

The eight cores of the Snapdragon 617 are divided into two quad-core clusters, each optimized for a different operating point. While one cluster can clock up to 1.5 GHz to handle more demanding applications, the other cluster is limited to a maximum of 1.2 GHz for energy-saving purposes. All eight cores can be active at the same time, although most applications aren't parallelized to support 8 cores efficiently.

Overall, the Snapdragon 617 offers a performance similar to that of the older Snapdragon 600 (Krait architecture).

GPU

Another new feature is the integrated graphics unit named Adreno 405 (most likely around 550 MHz). The Adreno 400 series has been substantially redesigned and supports DirectX 11.2 (FL 11_1) including hardware tessellation, OpenGL ES 3.1, and OpenCL 1.2. Furthermore, the performance has been significantly improved, which is now similar to the Adreno 320 and PowerVR G6200.

Features

The Snapdragon 617 offers numerous wireless technologies such as Bluetooth 4.0 and WLAN 802.11a/b/g/n/ac as well as a Multi-SIM cellular modem supporting LTE cat. 4 (up to 150 Mbps), WCDMA, CDMA, EV-DO, TD-SCDMA and GSM/EDGE.

The SoC can encode and decode 1080p videos using dedicated hardware and stream content to displays with up to 2560 x 2048 pixels. A large number of video codecs including H.265 (playback only) will be supported. The camera ISP can handle sensors with up to 21 MP.

Power Consumption

The Snapdragon 617 is manufactured by TSMC in a 28 nm LP process. According to the specifications, we expect a medium or medium-high power consumption for use in medium-sized or larger smartphones and tablets.

Mediatek Helio G25

The Mediatek Helio G25 is an entry level ARM SoC for smartphones (mainly Android based) that was introduced in late 2020. It is manufactured in a 12 nm FinFET process and is equipped with 8 ARM Cortex-A53 CPU cores divided in two clusters. A performance cluster with 4 cores clocked at up to 2 GHz and a efficiency cluster clocked at up to 1.5 GHz. Compared to the similar Helio A25, the G25 clocks the GPU (+50 MHz) and the CPU cores higher (+200 MHz).

Furthermore, the SoC integrates a LTE Cat.4 modem, a LPDDR3-933 / LPDDR4-1200 / LPDDR4x-1600 memory controller, a IMG PowerVR GE8320 graphics card and a 1080p30 video de- and encoder (H.265 decoding, H.264 encoding).

Mediatek Helio G37

The Mediatek Helio G37 is an entry level ARM SoC for smartphones (mainly Android based) that was introduced in late 2020. It is manufactured in a 12 nm FinFET process and is equipped with 8 ARM Cortex-A53 CPU cores clocked at up to 2.3 GHz. They are divided in two clusters, with the four efficiency cores only clock up to 1.8 GHz. Compared to the similar Helio G35, the G37 offers support for 90 Hz displays and 8 GB RAM.

The performance of the G37 is positioned in the entry level and especially the single core performance is very slow due to the small A53 cores and no big performance cores.

Furthermore, the SoC integrates a LTE Cat.4 modem, a Wi-Fi 5 / Bluetooth 5.0 modem, a LPDDR3-933 / LPDDR4-1200 / LPDDR4x-1600 memory controller, a IMG PowerVR GE8320 graphics card, and a 1080p30 video de- and encoder (H.265 decoding, H.264 encoding).

The G37 is produced in 12nm FinFET.