Qualcomm Snapdragon 435 vs HiSilicon Kirin 655 vs Qualcomm Snapdragon 626

Qualcomm Snapdragon 435

The Qualcomm Snapdragon 435 (SD435) is a lower mainstream SoC for (Android based) smartphones and tablets. Contrary to the Snapdragon 630, it is still manufactured in a 28-nm process and also consists of an octa-core CPU part with ARM Cortex-A53 cores. However, they are only clocked at up to 1.4 GHz. The integrated X9 LTE modem supports Cat. 4 with maximum transfer rates of 300 Mbps (downstream) and 100 Mbps (upstream). The SoC also includes an Adreno 505 GPU with support for Vulkan and OpenGL ES 3.1. WiFi 802.11ac and Bluetooth 4.1 are supported as well. The memory controller supports LPDDR3 clocked at 800 MHz (so probably dual-channel DDRL-1600). The main difference to the Snapdragon 430 is the faster LTE modem.

HiSilicon Kirin 655

The HiSilicon Kirin 655 is an ARM-based octa-core SoC for mid-range smartphones and tablets. It was announced late 2016 and features eight ARM Cortex-A53 cores. Four cores can be clocked with up to 1.7 GHz (power saving cores) and four with up to 2.1 GHz (performance cores). The difference to the older Kirin 650 is the 100 MHz higher clock speed of the performance cores.

Furthermore, a ARM Mali-T830 MP2 graphics card (at 600 MHz or 900 MHz with 40.8 GFLOPS), a 64-Bit LPDDR3 memory controller and a dual-sim capable LTE Cat. 6 (max. 300 MBit/s and GSM, WCDMA, UMTS, HSPA+) radio are integrated in the SoC. The processor performance can be compared with the older Kirin 930 and therefore sufficient for daily usage as browsing and non demanding apps. High-end SoCs with Cortex-A57 or A72 cores however should be noticeably faster. The SoC is produced in a modern 16nm FinFET process and is therefore very power efficient.

Qualcomm Snapdragon 626

The Qualcomm Snapdragon 626 (SD626) is a mid-range octa-core SoC with eight ARM Cortex-A53 cpu cores at up to 2.2 GHz, an Adreno 506 GPU, a DDR3L-1866 memory controller and a X9 LTE (Cat 7, 4G+, 300 Mbps down, 150 Mbps up) modem. Furthermore, the chip supports 802.11ac WiFi and Bluetooth 4.1. It is manufactured in 14nm FinFet. The processor performance should be a bit higher than the average Snapdragon 625, due to the 200 MHz higher maximum clock speed.