The new Kirin 820 SoC is on par with the Snapdragon 855: new leak

Honor has reportedly announced that it will introduce the 30S (probably virtually) to the Chinese market on March 30, 2020. This successor to the mid-range 20S variant should be interesting as it is anticipated to be the world's first Kirin 820-powered device. Therefore, interested consumers may be raring to know what they can expect in terms of performance for their money. Should a new leak prove valid, they should be more than happy with the answer.

According to ITHome, a Weibo user has gotten hold of this new chipset's Geekbench 4 single- and multi-core scores, and has drawn up a graph comparing them to the same for 2 much better-known chipsets: the Kirin 980 and Snapdragon 855. The image depicts the 820 as capable of beating the 2-year-old flagship chipset from its own maker, whereas it is more or less equal to the 855.

Presuming these findings are genuine, it is a good initial indication for the 820 in that it can apparently take on SoCs that remain powerful even if their heyday has passed. The newer chipset in this graph is reportedly made up of ARM Cortex-A76 cores, as well as an improved GPU (the Mali-G67) compared to its predecessor. This new leak also purports to add a little extra detail to these rumors: the 820 apparently has 8 cores of the former and 10 for the latter.

Furthermore, Kirin 820 is currently believed to integrate 5G connectivity by default (this is based on official teasers that point to the same for the 30S). Therefore, it appears that HiSilicon may be setting it up to take on the Snapdragon 765-series chips of the world. However, any confirmation of all this speculation hangs on the 30S' now-scheduled debut.