The Snapdragon 450 is Qualcomm's newest 14nm midrange SoC
As one of the biggest system-on-a-chip manufacturers in the world, Qualcomm could not miss the opportunity to present its latest innovations at this year’s Mobile World Congress in Shanghai, which opened its doors earlier today. The latest SoC model from Qualcomm comes in the form of Snapdragon 450, the direct successor of the 435 chip launched in 2016.
Here are the most important highlights of the 450 SoC:
• it’s the first 14nm FinFET chip in its tier, delivering improved power efficiency
• the chip integrates the octa-core ARM Cortex A53 CPU clocked at 1.8Ghz
• the integrated GPU solution features the Adreno 506, which boosts performance by 25% compared to the previous 435 chip
• the battery life has been improved, resulting into 4 additional hours of usage over the previous 435 chip
• the 14nm architecture reduces power consumed during gaming sessions by 30%
• support for Qualcomm Quick Charge 3.0 that is able to charge the battery from 0 to 80% in only 35 minutes
• the new camera supports real-time Bokeh effects and dual mode 13+13 MP or single mode 21 MP resolutions
• the latest Qualcomm Hexagon Digital Signal Processor is integrated in order to enable multimedia, camera and sensor processing at improved performance and lower power over previous generations
• the LTE connectivity is extended with the latest Snapdragon X9 LTE modem that supports downlink speeds of up to 300 Mbps and uplink speeds of up to 150 Mbps with 802.11ac MU-MIMO specs
• added support for the USB 3.0 interface
Qualcomm also announced the availability of the new chip. Commercial sampling is expected to begin in Q3 this year, while retail device integration should begin in Q4.