Qualcomm Snapdragon 8 Gen 3 vs MediaTek Dimensity 8300-Ultra
Qualcomm Snapdragon 8 Gen 3
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The Qualcomm Snapdragon 8 Gen. 3 (SM8650-AB) mobile platform is a high end SoC for Android-based smartphones and tablets.
The cryo-CPU is based on ARM's v9.2 architecture and consists of three clusters: The first includes a fast prime core (ARM Cortex-X4) with up to 3.3 GHz. The second consists of three power cores with up to 3.2 GHz and two additional cores clocking at up to 3.0 GHz (all Cortex-A720). The efficiency cluster consists of two power-saving cores (Cortex-A520) that operate at up to 2.3 GHz. The SoC uses the integrated Adreno 750 for graphics acceleration.
Compared to the Snapdragon 8 Gen. 2, Qualcomm promises a 25 percent higher GPU clock rate, whose power consumption is said to have been reduced by 25 percent at the same time. Similarly, the CPU's performance is announced to be now a whopping 30 per cent faster and requires 20 per cent less power.
A special focus is also placed on machine learning (AI). The integrated Hexagon NPU is 98% faster than its predecessor and promises a 40% improvement in efficiency. Qualcomm's AI engine is the first to support multimodal generative AI models, including LLM, LVM and ASR, and can process up to 10 trillion parameters directly on the SoC. Image manipulation is said to be possible within fractions of a second. In addition, the NPU of the Snapdragon 8 Gen 3 is also capable of INT4 and Meta Llama 2.
Also back on board is Snapdragon Sight, Qualcomm's brand for camera functions. In addition to Ultra HDR, Dolby HDR is also supported for photos. Photos can now be enhanced by generative AI models and with the Video Magic Eraser (ArcSoft), unwanted people and objects can also be removed from videos. In addition, the ISP is able to distinguish real photos from AI-generated content. This is again a triple ISP (Image Signal Processor), which works with 18 bits and up to 12 layers.
The integrated Snapdragon X75 Modem-RF 5G system allows simultaneous transfers of 5G-mmWave and 5G-Sub6, enabling data rates of up to 10 GBit/s in download and up to 3.5 GBit/s in upload. In addition, the modem is able to support all known 5G bands worldwide. Qualcomm's FastConnect 7800 is once again responsible for local communication, which can handle Bluetooth 5.4 with LE Audio and Wi-Fi 7, among other things.
The SoC is manufactured by TSMC in a 4 nm process.
MediaTek Dimensity 8300-Ultra
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The MediaTek Dimensity 8300-Ultra presented in Q4 2023 is an ARM-based SoC (system-on-a-chip) that is manufactured using the 4 nm process. It was specially designed for use in Android smartphones and is in the lower upper class in terms of performance. It supports all current mobile communication standards, including 5G SA.
The CPU works with a total of eight cores, which are divided into two clusters. The first cluster contains one ARM Cortex-A715 power core, which operates at up to 3.35 GHz. In addition, there are 3 further ARM Cortex-A715 cores with 3.2 GHz. The second cluster contains four ARM Cortex-A510 energy-saving cores with 2.2 GHz. LPDDR5 RAM can be used as RAM and UFS 4.0 is supported as internal memory.
Compared to the predecessor MediaTek Dimensity 8200-Ultra the MediaTek Dimensity 8300-Ultra is said to offer up to 20 percent higher CPU performance and up to 60 percent higher GPU performance. According to the manufacturer, the energy efficiency for CPU and GPU has also improved (+30%/+55%).
In terms of connectivity, dual 5G with a theoretical peak download speed of up to 5.17 GBit/s is available, as well as WiFi 6E and Bluetooth 5.4.
The Mediatek Dimensity 8300-Ultra is a variant of the otherwise identical Mediatek Dimensity 8300 that has been specially adapted for Xiaomi and features improvements to the camera ISP. An Imagiq 980 image processor is responsible for processing the camera data. Video recordings are supported with up to 4K at 60 fps.
The integrated ARM Mali-G615 MC6 graphics unit can control displays with a resolution of up to 2,960 x 1,440 pixels (WQHD+) and a refresh rate of up to 120 Hz. With Full HD+, even up to 180 Hz is possible.
Model | Qualcomm Snapdragon 8 Gen 3 | MediaTek Dimensity 8300-Ultra | ||||||||||||
Codename | Cortex-X4 / A720 / A720 / A520 (Kryo) | Cortex-A15 / A510 | ||||||||||||
Series | Qualcomm Snapdragon 8 | |||||||||||||
Series: Snapdragon 8 Cortex-X4 / A720 / A720 / A520 (Kryo) |
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Clock | 2300 - 3300 MHz | 2200 - 3350 MHz | ||||||||||||
L3 Cache | 8 MB | 4 MB | ||||||||||||
Cores / Threads | 8 / 8 1 x 3.3 GHz ARM Cortex-X4 3 x 3.2 GHz ARM Cortex-A720 2 x 3.0 GHz ARM Cortex-A720 2 x 2.3 GHz ARM Cortex-A520 | 8 / 8 3.4 GHz 4 x 3.2 GHz ARM Cortex-A715 4 x 2.2 GHz ARM Cortex-A510 | ||||||||||||
Technology | 4 nm | 4 nm | ||||||||||||
Features | Adreno GPU, Spectra ISP, Hexagon, X70 5G Modem, FastConnect 7800 Wi-Fi 7, LPDDR5x 4800 MHz Memory Controller | ARM Mali-G610 MC6 GPU, Dual 5G modem, WiFi 6E, Bluetooth 5.3, H.264/HEVC video decoding | ||||||||||||
iGPU | Qualcomm Adreno 750 ( - 903 MHz) | ARM Mali-G615 MP6 | ||||||||||||
Architecture | ARM v9 | ARM | ||||||||||||
Announced | ||||||||||||||
Manufacturer | www.qualcomm.com | www.mediatek.com |
Benchmarks
Average Benchmarks Qualcomm Snapdragon 8 Gen 3 → 100% n=23
Average Benchmarks MediaTek Dimensity 8300-Ultra → 77% n=23

* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation