Qualcomm Snapdragon 8 Gen 2 vs Qualcomm Snapdragon 8 Gen 3

Qualcomm Snapdragon 8 Gen 2

The Qualcomm Snapdragon 8 Gen 2 Mobile Platform is a high-end SoC for smartphones that was introduced in late 2022 and manufactured in 4 nm at TSMC (N4P). It integrates four different CPU clusters. A fast and big prime core based on the ARM Cortex-X3 architecture and clocked at up to 3.2 GHz for 64 bit applications. Two more ARM Cortex-A715 based performance cores clocked at up to 2.8 GHz (also only for 64 bit apps). Two more Cortex-A710 performance cores at up to 2.8 GHz that can also be used for older apps and three efficiency cores (ARM Cortex-A510 with up to 2 GHz). All cores can use the shared 8 MB level 3 cache.

Thanks to the new architecture and high clock rates, the SD 8 Gen 2 is the fastest mobile CPU for Android based devices and is only topped by current Apple SoCs like the Apple A16 (see benchmarks below).

The chip also integrates a Hexagon accelerator for AI workloads (tensor, scalar and vector). Qualcomm states that its one of the first chips with INT4 support and up to 4.35x performance compared to the previous generation. 

The 18-Bit-Spectra ISP is able to process photos with up to 200 MP and work with videos up to 8k30 (including 10-bit, HDR10+, HLG and Dolby Vision).

A big improvement of the Snapdragon 8 G2 is the integrated Adreno 740 GPU, that now supports Hardware Raytracing and tops even the iGPU in the Apple A16.

The integrated AI Engine can offer up to 4x faster AI performance thanks to the bigger Tensor engine. The 18-Bit-Spectra-ISP also saw some big improvements and is now called Snapdragon Sight.

The integrated Adreno 730 offers a 30% graphics boost compared to the previous Adreno 660.

The integrated Snapdragon X70 5G modem is also new as is the FastConnect 7800 modem with Wi-Fi 7 and Bluetooth 5.3 support.

Qualcomm Snapdragon 8 Gen 3

The Qualcomm Snapdragon 8 Gen. 3 (SM8650-AB) mobile platform is a high end SoC for Android-based smartphones and tablets. 

The cryo-CPU is based on ARM's v9.2 architecture and consists of three clusters: The first includes a fast prime core (ARM Cortex-X4) with up to 3.3 GHz. The second consists of three power cores with up to 3.2 GHz and two additional cores clocking at up to 3.0 GHz (all Cortex-A720). The efficiency cluster consists of two power-saving cores (Cortex-A520) that operate at up to 2.3 GHz. The SoC uses the integrated Adreno 750 for graphics acceleration. 

Compared to the Snapdragon 8 Gen. 2, Qualcomm promises a 25 percent higher GPU clock rate, whose power consumption is said to have been reduced by 25 percent at the same time. Similarly, the CPU's performance is announced to be now a whopping 30 per cent faster and requires 20 per cent less power.

A special focus is also placed on machine learning (AI). The integrated Hexagon NPU is 98% faster than its predecessor and promises a 40% improvement in efficiency. Qualcomm's AI engine is the first to support multimodal generative AI models, including LLM, LVM and ASR, and can process up to 10 trillion parameters directly on the SoC. Image manipulation is said to be possible within fractions of a second. In addition, the NPU of the Snapdragon 8 Gen 3 is also capable of INT4 and Meta Llama 2. 

Also back on board is Snapdragon Sight, Qualcomm's brand for camera functions. In addition to Ultra HDR, Dolby HDR is also supported for photos. Photos can now be enhanced by generative AI models and with the Video Magic Eraser (ArcSoft), unwanted people and objects can also be removed from videos. In addition, the ISP is able to distinguish real photos from AI-generated content. This is again a triple ISP (Image Signal Processor), which works with 18 bits and up to 12 layers. 

The integrated Snapdragon X75 Modem-RF 5G system allows simultaneous transfers of 5G-mmWave and 5G-Sub6, enabling data rates of up to 10 GBit/s in download and up to 3.5 GBit/s in upload. In addition, the modem is able to support all known 5G bands worldwide. Qualcomm's FastConnect 7800 is once again responsible for local communication, which can handle Bluetooth 5.4 with LE Audio and Wi-Fi 7, among other things.

The SoC is manufactured by TSMC in a 4 nm process.