Qualcomm Snapdragon 8 Gen 2 vs MediaTek Dimensity 8100 vs MediaTek Dimensity 8200-Ultra
Qualcomm Snapdragon 8 Gen 2
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The Qualcomm Snapdragon 8 Gen 2 Mobile Platform is a high-end SoC for smartphones that was introduced in late 2022 and manufactured in 4 nm at TSMC (N4P). It integrates four different CPU clusters. A fast and big prime core based on the ARM Cortex-X3 architecture and clocked at up to 3.2 GHz for 64 bit applications. Two more ARM Cortex-A715 based performance cores clocked at up to 2.8 GHz (also only for 64 bit apps). Two more Cortex-A710 performance cores at up to 2.8 GHz that can also be used for older apps and three efficiency cores (ARM Cortex-A510 with up to 2 GHz). All cores can use the shared 8 MB level 3 cache.
Thanks to the new architecture and high clock rates, the SD 8 Gen 2 is the fastest mobile CPU for Android based devices and is only topped by current Apple SoCs like the Apple A16 (see benchmarks below).
The chip also integrates a Hexagon accelerator for AI workloads (tensor, scalar and vector). Qualcomm states that its one of the first chips with INT4 support and up to 4.35x performance compared to the previous generation.
The 18-Bit-Spectra ISP is able to process photos with up to 200 MP and work with videos up to 8k30 (including 10-bit, HDR10+, HLG and Dolby Vision).
A big improvement of the Snapdragon 8 G2 is the integrated Adreno 740 GPU, that now supports Hardware Raytracing and tops even the iGPU in the Apple A16.
The integrated AI Engine can offer up to 4x faster AI performance thanks to the bigger Tensor engine. The 18-Bit-Spectra-ISP also saw some big improvements and is now called Snapdragon Sight.
The integrated Adreno 730 offers a 30% graphics boost compared to the previous Adreno 660.
The integrated Snapdragon X70 5G modem is also new as is the FastConnect 7800 modem with Wi-Fi 7 and Bluetooth 5.3 support.
MediaTek Dimensity 8100
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The Mediatek Dimensity 8100 is a upper mid-range smartphone SoC. The CPU integrates four fast ARM Cortex-A78 cores with up to 2.85 GHz and four efficient Cortex-A55 cores with up to 2 GHz. The integrated 5G modem supports all modern standards including 5G SA and a maximum download speed of 4.7 Gbps.
The integrated ARM Mali-G610 MC6 GPU integrates 6 cores and supports displays with up to 2,960 x 1,440 pixels (WQHD+).
The chip is produced at TSMC in 5nm.
MediaTek Dimensity 8200-Ultra
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The MediaTek Dimensity 8200-Ultra is a upper mid-range ARM-based SoC (system-on-a-chip) that is manufactured using the modern 4 nm process. It was specially designed for use in Android smartphones and is in the upper class in terms of performance. It supports all current mobile communication standards, including 5G SA.
The CPU works with a total of eight cores, which are divided into two clusters. In the first cluster, an ARM Cortex-A78 power core clocked at 3.1 GHz is joined by three further ARM Cortex-A78 power cores clocked at 3 GHz. In the second cluster, four ARM Cortex-A55 power cores operate at 2.0 GHz. LPDDR5 RAM can be used as RAM and UFS 3.1 is supported as internal memory.
In terms of connectivity, dual 5G with a theoretical peak download speed of up to 4.7 GBit/s is available, as well as WiFi 6E and Bluetooth 5.3.
The Mediatek Dimensity 8200-Ultra is a variant of the otherwise identical Mediatek Dimensity 8200 that has been specially customised for Xiaomi and features improvements to the camera ISP. An Imagiq 785 image processor is responsible for processing the camera data. Video recordings are supported with up to 4K at 60 fps. The CPU part of the older Dimensity 8100 is very similar and offers the same CPU and GPU cores.
The integrated ARM Mali-G610 MC6 graphics unit can power displays with a resolution of up to 2,960 x 1,440 pixels (WQHD+) and a refresh rate of up to 120 Hz. With Full HD+, even up to 180 Hz is possible.
Model | Qualcomm Snapdragon 8 Gen 2 | MediaTek Dimensity 8100 | MediaTek Dimensity 8200-Ultra | ||||||||
Codename | Cortex-X3 / A715 / A710 / A510 (Kryo) | Cortex-A78 / A55 | Cortex-A78 / A55 | ||||||||
Series | Qualcomm Snapdragon 8 | ||||||||||
Series: Snapdragon 8 Cortex-X3 / A715 / A710 / A510 (Kryo) |
| ||||||||||
Clock | 2000 - 3200 MHz | 2000 - 2850 MHz | 2000 - 3100 MHz | ||||||||
L3 Cache | 8 MB | 4 MB | |||||||||
Cores / Threads | 8 / 8 1 x 3.2 GHz ARM Cortex-X3 2 x 2.8 GHz ARM Cortex-A715 2 x 2.8 GHz ARM Cortex-A710 3 x 2.0 GHz ARM Cortex-A510 | 8 / 8 | 8 / 8 1 x 3.1 GHz ARM Cortex-A78 3 x 3.0 GHz ARM Cortex-A78 4 x 2.0 GHz ARM Cortex-A55 | ||||||||
Technology | 4 nm | 6 nm | 4 nm | ||||||||
Features | Adreno GPU, Spectra ISP, Hexagon, X70 5G Modem, FastConnect 7800 Wi-Fi 7, LPDDR5x 4200 MHz Memory Controller | 4x ARM Cortex-A77 (2.85 GHz), 4x ARM Cortex-A55 (2 GHz), ARM Mali-G610 MC6, APU 580, 5G Modem, MiraVision 780, Wi-Fi 6E, Bluetooth 5.3, UFS 3.1, LPDDR5 | ARM Mali-G610 MC6 GPU, Dual 5G modem, WiFi 6E, Bluetooth 5.3, H.264/HEVC video decoding | ||||||||
iGPU | Qualcomm Adreno 740 | ARM Mali-G610 MP6 | ARM Mali-G610 MP6 | ||||||||
Architecture | ARM v9 | ARM | ARM | ||||||||
Announced | |||||||||||
Manufacturer | www.qualcomm.com | www.mediatek.com | www.google.com |
Benchmarks
Average Benchmarks Qualcomm Snapdragon 8 Gen 2 → 100% n=21
Average Benchmarks MediaTek Dimensity 8100 → 67% n=21
Average Benchmarks MediaTek Dimensity 8200-Ultra → 75% n=21

* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation