Qualcomm Snapdragon 8+ Gen 1 vs MediaTek Dimensity 9000

Qualcomm Snapdragon 8+ Gen 1

The Qualcomm Snapdragon 8+ Gen 1 Mobile Platform is a high-end SoC for smartphones that was introduced in mid 2022 and manufactured in 4 nm at TSMC. It integrates one “Prime Core” based on a ARM Cortex-X2 architecture clocked at up to 3.2 GHz. Three more performance cores are based on the Cortex-A710 but clocked up to 2.5 GHz. Furthermore, four energy saving cores are integrated that are based on the ARM Cortex-A510 architecture and clocked at up to 1.8 GHz. All cores can use the shared 6 MB level 3 cache.

Compared to the Snapdragon 8 Gen 1, the SoC is now produced in the more power efficient 4nm process at TSMC and offers higher clocked CPU and GPU cores (at a lower power consumption according to Qualcomm).

The integrated AI Engine can offer up to 4x faster AI performance thanks to the bigger Tensor engine. The 18-Bit-Spectra-ISP also saw some big improvements and is now called Snapdragon Sight.

The integrated Adreno 730 offers a 30% graphics boost compared to the previous Adreno 660.

The integrated Snapdragon X65 5G modem is also new and offers faster transfer rates (up to 10 Gbps download and 3 Gbps upload). The FastConnect 6900 offers support for the current Wifi 6E and Bluetooth 5.2.

MediaTek Dimensity 9000

The MediaTek Dimensity 9000 is a high-end SoC with an integrated 5G modem. It includes one fast Cortex-X2 core with up to 3 GHz, three more A710 cores with up to 2.85 GHz and four power efficiency cores (Cortex-A510) with upto 1.8 GHz. The SoC is manufactured in the new 4nm process at TSMC. All CPU cores can together use 8 MB of level 3 cache and 6 MB of System Level Cache (SLC).

The integrated quad channel memory controller supports LPDDR5X with 7500 Mbps. The integrated GPU is an ARM Mali-G710 MC10 (10 of the 16 possible cores).

The Dimensity 9000 is one of the first chips to be produced in the modern 4nm process at TSMC