Qualcomm Snapdragon 7+ Gen 2 vs MediaTek Dimensity 7300 vs MediaTek Dimensity 7030

Qualcomm Snapdragon 7+ Gen 2

The Qualcomm Snapdragon 7+ Gen 2 is a fast mid-range SoC with 8 cores for smartphones and tablets (mainly Android-based). It was introduced at the beginning of 2023 and brings significant advantages compared to the predecessor, the Snapdragon 7 Gen 1 (hence the direct jump to the Plus naming).

Qualcomm combines a powerful ARM Cortex-X2 performance core with clock rates up to 2.91 GHz with three Cortex-A710 cores at 2.49 GHz and with four frugal Cortex-A510 efficiency cores at 1.8 GHz. An Adreno 725 is used as the GPU, which supports Vulkan 1.1 and Snapdragon Elite Gaming. 

Qualcomm speaks of a 50 percent better processor performance and twice the GPU and AI performance, as well as a 13 percent improved efficiency, each compared to the Snapdragon 7 Gen 1.

The integrated ISP can handle photos from a 200 MP camera as well as 4K HDR videos. Qualcomm promises a particularly effective night mode, in which 30 photos are taken almost simultaneously and combined into a brighter image. The AI accelerator is not only twice as fast, but also 40 percent more efficient, enabling AI Super Resolution, among other things, so games and videos can be intelligently scaled to a higher resolution.

The integrated Bluetooth chip supports Qualcomm aptX Lossless as well as Qualcomm High Speed Link for a more stable connection. Qualcomm also installs a Snapdragon X62 5G modem that achieves a download speed of up to 4.4 Gbps. The FastConnect 6900 chip supports Wi-Fi 6 and also Wi-Fi 6E. 

The SoC is manufactured in the modern 4nm process at TSMC and should have a very good energy efficiency.

MediaTek Dimensity 7300

The MediaTek Dimensity 7300 is an ARM-based mid-range SoC for (mostly Android based) smartphones. The integrated CPU is divided into two clusters with four larger ARM Cortex-A78 cores with up to 2.5 GHz clock speed and an efficiency cluster with four ARM Cortex-A55 cores with up to 2 GHz.

In addition to the integrated ARM Mali-G615 MC2 iGPU, the 7300 also offers a MediaTek APU 655 for AI tasks. Furthermore, a 5G multi-mode modem is installed (2G - 5G) with up to 3.27 Gbps download speed. In addition to Wi-Fi 6E, Bluetooth 5.4 is also supported.

The chip is manufactured using the modern 4nm process and is advertised to consume 25% less power compared to the older Dimensity 7050.

MediaTek Dimensity 7030

The Mediatek Dimensity 7030 is a mid-range ARM SoC (system-on-a-chip) that can be used in both smartphones and tablets (mainly Android). The SoC was introduced in September 2023.

It includes a 5G modem and supports the latest mobile phone standards in dual-SIM mode with both cards, so that surfing and phoning is possible via two different cards at the same time. The SoC integrates two ARM Cortex A78 cores with up to 2.5 GHz for demanding tasks and six low-power ARM Cortex A55 cores with clock speeds of up to 2 GHz.

The chip has an integrated sub-6 GHz and mmWave 5G modem including dual-SIM support that can reach a maximum download speed of up to 4.6 Gbps. Wi-Fi 6E (802.11ax) is supported as well as Bluetooth 5.2. 

The memory controller can cope with LPDDR4x or LPDDR5 working memory as well as UFS 3.1 mass storage. As an integrated graphics card, the SoC uses the Mali-G610 MP3, which supports displays with 144 Hz as well as HDR10+ Adaptive, HLG and Dolby Vision at a maximum resolution of 2,520 x 1,080 pixels.

Compared to the Dimensity 920, the CPU unit has the same clock speeds but a more modern instruction set, ARMv8.2-A. A new graphics unit is used and WiFi 6E is supported, as well as displays with up to 144 Hz.

The SoC is manufactured in a 6nm process.