Qualcomm Snapdragon 6 Gen 1 vs MediaTek Dimensity 7300 vs MediaTek Dimensity 1300
Qualcomm Snapdragon 6 Gen 1
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The Qualcomm Snapdragon 6 Gen 1 (SM6450) mobile platform was designed for Android-based smartphones and tablets and was launched in September 2022. The SoC (system-on-a-chip) is in the entry-level class and is based on ARM's v9 architecture.
The cryo CPU of the Snapdragon 6 Gen 1 is based on four ARM Cortex-A78 performance cores with clock frequencies of up to 2.2 GHz and an efficiency cluster consisting of four Cortex-A55 cores with a clock frequency of 1.8 GHz.
An Adreno 710 is used as the integrated graphics unit. The Soc also integrates a Spectra ISP (200 MP photo), a dual-channel 16-bit LPDDR 2750 MHz memory controller, an X62 5G modem (max 2.9 GBit/s download, 1.6 Gbit/s upload), a Fastconnect 6700 Wi-Fi 6E / Bluetooth 5.2 modem and Hexagon.
The SoC is manufactured in the modern 4 nm process at Samsung.
MediaTek Dimensity 7300
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The MediaTek Dimensity 7300 is an ARM-based mid-range SoC for (mostly Android based) smartphones. The integrated CPU is divided into two clusters with four larger ARM Cortex-A78 cores with up to 2.5 GHz clock speed and an efficiency cluster with four ARM Cortex-A55 cores with up to 2 GHz.
In addition to the integrated ARM Mali-G615 MC2 iGPU, the 7300 also offers a MediaTek APU 655 for AI tasks. Furthermore, a 5G multi-mode modem is installed (2G - 5G) with up to 3.27 Gbps download speed. In addition to Wi-Fi 6E, Bluetooth 5.4 is also supported.
The chip is manufactured using the modern 4nm process and is advertised to consume 25% less power compared to the older Dimensity 7050.
MediaTek Dimensity 1300
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The Mediatek Dimensity 1300 is a high-end SoC with an integrated 5G modem. It includes three CPU clusters. One fast ARM Cortex-A78 at up to 3 GHz with 2x L2 cache, 3 additional A78 with up to 2.6 GHz and for power efficiency four ARM Cortex-A55 cores at up to 2 GHz. The SoC looks to be identical to the older Dimensity 1200.
Furthermore, the chip integrates a 9 core ARM Mali-G77 MC9 GPU, a Wi-fi 6 modem (ax), a LPDDR4x memory controller (up to 5266Mbps), a AI processing unit (APU 3.0 with 6 cores) and video de- and encoding (including AV1).
The chip is manufactured in the modern 6nm process and should be very power efficient.
| Model | Qualcomm Snapdragon 6 Gen 1 | MediaTek Dimensity 7300 | MediaTek Dimensity 1300 | ||||||||
| Codename | Cortex-A78 / A55 | Cortex-A78 / A55 | Cortex-A78 / A55 | ||||||||
| Series | Qualcomm Snapdragon 6 | ||||||||||
| Series: Snapdragon 6 Cortex-A78 / A55 |
| ||||||||||
| Clock | 1800 - 2200 MHz | 2000 - 2500 MHz | 2000 - 3000 MHz | ||||||||
| Cores / Threads | 8 / 8 4 x 2.2 GHz ARM Cortex-A78 4 x 1.8 GHz ARM Cortex-A55 | 8 / 8 4 x 2.6 GHz ARM Cortex-A78 4 x 2.0 GHz ARM Cortex-A55 | 8 / 8 | ||||||||
| Technology | 4 nm | 4 nm | 6 nm | ||||||||
| Features | 12-Bit Spectra Triple ISP, 7th Gen AI Engine, Wi-Fi 6E, X62 5G Modem | 1x ARM Cortex-A78 (3 GHz), 3x A78 (2.6 GHz), 4x ARM Cortex-A55 (2 GHz), ARM Mali-G75 MC5, APU 3.0, 5G Modem, MiraVision (4K HDR Video, 80MP Photo), Wi-Fi 6, Bluetooth 5.2, UFS 3.1, 16GB-4266 LPDDR4x Support | |||||||||
| iGPU | Qualcomm Adreno 710 | ARM Mali-G615 MP2 | ARM Mali-G77 MP9 | ||||||||
| Architecture | ARM | ARM | ARM | ||||||||
| Announced | |||||||||||
| Manufacturer | www.qualcomm.com | www.mediatek.com | www.mediatek.com |
Benchmarks
Average Benchmarks Qualcomm Snapdragon 6 Gen 1 → 100% n=6
Average Benchmarks MediaTek Dimensity 7300 → 123% n=6
Average Benchmarks MediaTek Dimensity 1300 → 106% n=6
- Average benchmark values for this graphics card* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation
