AMD Ryzen AI 9 HX PRO 475 vs AMD Ryzen AI 5 435

AMD Ryzen AI 9 HX PRO 475

The AMD Ryzen AI 9 HX PRO 475 is a powerful Gorgon Point family processor that debuted at CES in early 2026. The SoC is a refresh of the Strix Point HX 375 with higher clocked CPU, GPU and NPU. The APU comes equipped with 12 CPU cores running at 2.0 GHz to 5.2 GHz along with the 16 CU RDNA 3.5 Radeon 890M graphics adapter and the 60 TOPS XDNA 2 neural engine. Other noteworthy features include PCIe 4, USB 4 and LPDDR5x-8533 RAM support. Compared to the consumer Ryzen AI 9 HX 475, the PRO variant offers additional management and security features like support for ECC RAM.

Of the 12 CPU cores, 4 are full Zen 5 cores and 8 are smaller Zen 5c cores. The latter probably run at somewhat lower clock speeds than the former.

This Ryzen AI 9 series APU shares most of the specifications with the Ryzen AI 9 HX 370.

Architecture and Features

Gorgon Point family APUs are a refresh of Strix Point 300 series APUs and offer higher clock speeds and support for faster LPDDR5x memory. It features the same Zen 5 and Zen 5c microarchitecture cores, the latter being a slightly slower, smaller and more power-efficient version of the full Zen 5 core. One of the differences between Zen 5 and Zen 5c is the cache size; Zen 5 cores have larger caches to work with. According to AMD, Zen 5 APUs deliver a 16% IPC improvement over Zen 4-powered APUs thanks to branch prediction improvements and other refinements.

Elsewhere, the HX 475 supports LPDDR5x-8533 and DDR5-5600 RAM (no ECC), and is also natively compatible with USB 4 (and therefore Thunderbolt). It has PCIe 4.0 support for a throughput of 1.9 GB/s per lane, just like its 8000 series predecessors did. The integrated XDNA 2 NPU is a lot more complex than the original XDNA was for up to 60 INT8 TOPS for accelerating various AI workloads. This is also the only difference to the Ryzen AI 9 HX 470 which offers the usual 55 TOPS NPU.

Performance

Given the striking similarity in specs, the performance of the Ryzen AI 9 HX 475 and 470 should be only slightly better than the old Ryzen AI 9 HX 375. Therefore, the SoC is a very fast mobile CPU that is well suited for demanding applications and games (with enough cooling and a high TDP setting).

Graphics

The Radeon 890M is the most powerful AMD iGPU, as of mid 2024. It features 16 RDNA 3.5 architecture CUs (1024 unified shaders) running at up to 3,100 MHz. Performance-wise, the graphics adapter can be as slow as the Arc 8 or as fast as the RTX 2050 Laptop depending on the benchmark or game. On average, the 890M finds itself very close to the GTX 1650 Laptop making it possible to play 2024 AAA games at 1080p with most settings set to Low.

Naturally, the AMD iGPU is capable of driving four SUHD 4320p60 monitors and it can also efficiently encode and decode the most popular video codecs including first and foremost AVC, HEVC, VP9 and AV1. The latest addition to that list, the VVC codec, is not supported unlike it is with Intel Lunar Lake chips.

Power consumption

The HX 475 is supposed to have a base TDP of 28 W, with laptop makers free to crank it up to up to 54 W if needed. Which they will most likely do to maximize performance.

The TSMC N4P process that the CPU cores are built with make for decent, as of mid 2024, power efficiency.

AMD Ryzen AI 5 435

The AMD Ryzen AI 5 435 or AMD Ryzen AI 5 H 435 is a powerful mobile processor from the Gorgon Point family that was announced at CES in early 2026. The APU integrates 6 CPU cores (2x Zen 5 with up to 4.5 GHz and 4x Zen 5c with less cache and a most likely maximum of 3.4 GHz) and a big 16 MB or 8 MB L3-Cache. The SoC is similar to the older but higher clocked AMD Ryzen AI 5 340.

Architecture and features

The Gorgon / Krackan Point family APUs are powered by Zen 5 and Zen 5c microarchitecture cores located in separate clusters, the latter being a slightly slower, smaller and more energy efficient version of the former. One of the differences between Zen 5 and Zen 5c is the size of the cache; the Zen 5 cores have larger caches available.

However, the mobile Zen 5 implementation is reportedly (ChipsAndCheese) is closer to desktop Zen 4 than desktop Zen 5 due to the different cache sizes, large differences in AVX-512 throughput, and other factors.

Elsewhere, the Ryzen AI 7 chip supports DDR5-5600 and LPDDR5x-8000 RAM, giving system designers a choice between lower latency and higher throughput. The chip is natively compatible with USB 4 (and therefore Thunderbolt). It has PCIe 4.0 support for a throughput of 1.9 GB/s per lane, just like its 8000 series predecessors. The integrated XDNA 2 NPU, which is much more complex than the first generation XDNA, delivers up to 50 INT8 TOPS for accelerating various AI workloads.

As usual with laptop CPUs, the Ryzen 5 AI chip cannot be replaced by the user as it is soldered.

Performance

With the given specs, the Ryzen 5 435 should be slightly slower than the old AMD Ryzen AI 5 340 which offers a similar core count but higher clock speeds.

Graphics

The Radeon 840M is a downscaled Radeon 890M that offers only 4 cores (CUs = 256 shaders) and clocks at up to 2.9 GHz. 

Power consumption

The AI 435 is said to have a base TDP of 28 W, although laptop manufacturers are free to set the TDP between 15 and 54 W.

The 4 nm TSMC process with which these CPUs are manufactured ensures above-average energy efficiency.